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Plasma Processing Wafers and Dies
The STW-10 automated plasma system optimizes front-end semiconductor processing, activating silicon surfaces for hybrid bonding. It handles 300 mm wafers or dies on tape frames.
Surfx Technologies
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| Viewpoint |
January 31, 2020
VIEWPOINT 2020: Jim Fraine, Director of Sales, North America, Marvin Test Solutions
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Jim Fraine, Director of Sales, North America, Marvin Test Solutions
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Much of the talk in the semiconductor world in 2019 revolved around smarter phones and cars. For smartphones it was the excitement of the advent of 5G technology to enable performance and functionality as never seen before.
In the automotive world it is the race to autonomous driving bringing unparalleled productivity, comfort and safety to the daily commute. While the promise of these new applications is yet to be fully realized, semiconductor manufacturers are working to address the challenges of mmWave device production and test.
Marvin Test Solutions (MTS) continues to integrate the flexibility, scalability, functionality and low cost of PXI technology with the performance mmWave capability of our RF partners, Keysight and Rohde and Schwarz, to provide test solutions that combine laboratory precision with production efficiency. MTS' PXI portfolio includes high performance digital, analog, FPGA and switching technology in a compact chassis to satisfy both the performance and cost goals of the semiconductor market, with the unrivaled long-term support our customers have come to rely upon.
Jim Fraine, Director of Sales, North America
Marvin Test Solutions
http://www.MarvinTest.com/
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Contamination Control
Balazs™ provides technical expertise in identifying and controlling Airborne Molecular Contamination (AMC) and Surface Molecular Contamination (SMC) for improving process and product yields.
Balazs Nanoanalysis
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