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January 6, 2020

VIEWPOINT 2020: Valentijn van Velthoven, Commercial Director, Boschman Advanced Packaging Technology
VIEWPOINT 2020: Valentijn van Velthoven, Commercial Director, Boschman Advanced Packaging Technology
Valentijn van Velthoven, Commercial Director, Boschman Advanced Packaging Technology
Has the China tariff dispute affected your business?
Not directly, but the dispute has indirectly sparked a trend for Chinese companies to reduce their dependency on US suppliers by looking for alternative solutions and technologies. This may create opportunities in the short-term for non-US suppliers, but the ultimate long-term goal is clearly "Made in China", resulting in a fundamental shift of technology and the supply chain.

How will you differentiate your company and technology?
We believe Boschman has a compelling and unique one-stop-shop offering for the emerging power electronics market. Our origins are in advanced packaging solutions for transfer molding. When pressure sintering started to mature about 5 years ago, Boschman was the first to market to realize the technology used for Transfer Molding, especially in the MEMS and Sensor segment (Pressure x Time x Temperature) was almost 1:1 applicable for Pressure Sintering. Our expertise in this area, combined with our patented technologies (Film Assist and Dynamic Inserts) where the keys to our success and market leadership in this emerging technology. We continue to expand our technology and expertise through our “eco system” of partnerships with material & other equipment suppliers, universities and early adopters.

Will you introduce new products or expand into new markets?
Most certainly, actually both. The electrification of vehicles is leading the demand for cutting edge packaging solutions for next-gen Power Modules by pushing the boundaries of existing materials and processes. Our early insight in this industry through our packaging development activities with leading customers, and above-mentioned partnerships, drives our internal roadmap for innovative product launches in both existing and new markets.

What are your expectations for semiconductor packaging next year?
Electrification of New Energy Vehicles will remain a very dynamic topic for semiconductor packaging in 2020. We see a number of unique packaging trends emerging that will require innovative approaches to industrialize these concepts. To achieve the aggressive timelines required by the market, innovation through unprecedented supply chain collaboration becomes an absolute must and a strong theme for 2020.

Valentijn van Velthoven, Commercial Director
Boschman Advanced Packaging Technology