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Viewpoint Index

January 16, 2017

VIEWPOINT 2017: Bill Moffat, Founder & CEO, Yield Engineering Systems, Inc.
VIEWPOINT 2017: Bill Moffat, Founder & CEO, Yield Engineering Systems, Inc.
Bill Moffat, Founder & CEO, Yield Engineering Systems, Inc.
2016 was an exceptional year for Yield Engineering Systems, Inc. (YES), due to the outstanding success of Fan-Out Wafer-Level Packaging (FOWLP).

In 2017, YES will expand our YES-450PB Series Dielectric Vacuum Cure Oven sales to sustain the FOWLP market. The YES proprietary process allows less than four hours process time with controllable 4° per minute ramp rates.

Another industry we are making great advances into is the DNA Array/Biotech market with our YES-ÉcoCoat Silane Vapor Phase Deposition System. YES-ÉcoCoat's main application is surface modification to promote adhesion which is a crucial step for the Biotech industry.

This year, YES will be introducing a brand new single wafer 200mm Plasma Resist Stripper. Created especially for the MEMS industry, it is aimed at the "one wafer per minute strip market" at a reasonable price.

YES expects the Semiconductor market to expand at a steady and controllable rate which will be good for our standard products. FOWLP will have significant double digit growth. This mixed with the growth of the DNA Array/Biotech industries places YES in a great position for 2017 and beyond.

William (Bill) Moffat, Founder & CEO
Yield Engineering Systems, Inc.