|
|
|
|
| Viewpoint | ||
January 13, 2017
VIEWPOINT 2017: Marco Notarianni, Ph.D., Platform Manager, Singulator®
Plasma-Therm systems perform critical process steps in the fabrication of integrated circuits, micro-mechanical devices, compound semiconductors, and other components of products ranging from consumer electronics to military systems and space satellites. Specifically, Plasma-Therm systems employ innovative plasma technology to etch and deposit thin films. The acquisitions of Nano Etch Systems (NES) Inc. of California, a developer of ion beam etch (IBE) and ion beam deposition (IBD) systems, and Nanoplas, a developer of low-temperature, low-damage surface preparation and stripping systems, significantly expanded Plasma-Therm's portfolio in the etch and deposition business. The superior performance of these systems, coupled with Plasma-Therm's award-winning customer service, make a compelling value proposition for manufacturers in data storage, MEMS, wireless, photonics, and other markets. In 2016, Plasma-Therm reached an important milestone in serving the advanced packaging industry with the signing of a global distribution agreement with DISCO, the leader in Dicing, Grinding, and Polishing (Kiru, Kezuru and Migaku) technologies. Plasma-Therm's Singulator® plasma dicing platform delivers superior dicing quality, productivity and design freedom to the advanced packaging market. The shipment of a 300mm Singulator® system to DISCO's R&D center in Tokyo in early 2017, along with increasing interest from OSATs and IDMs, demonstrates that the shift to plasma dicing technology is now underway. Marco Notarianni, Ph.D., Platform Manager Singulator® http://www.plasmatherm.com |
| We search for industry news so you don't need to. | ||
|
|
Free Newsletter Subscription
Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it. Insert Your Email Address |
|
|