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Viewpoint Index

January 10, 2017

VIEWPOINT 2017: Thomas Uhrmann, Director of Business Development, EV Group
VIEWPOINT 2017: Thomas Uhrmann, Director of Business Development, EV Group
Thomas Uhrmann, Director of Business Development, EV Group
Looking back on 2016, the semiconductor industry witnessed many new developments in advanced packaging. Among these was the production of the first hybrid bonded image sensor, which enables high-performance image processing as well as on-sensor memory to provide faster extraction and processing of images.

We expect further adoption of stacked image sensors in consumer, automotive and household devices. The device design and layout will progress from row/column connection with via-last toward hybrid bonding.

Adoption of hybrid bonding will be dependent on the ability to reduce the pitch of the hybrid bond pads - from connecting an array of pixels between the two stacked image sensor layers to the point of single-pixel connection. This will require new technology implementation to further reduce the overlay alignment of our SmartView NT2 aligner used for wafer bonding.

Looking ahead to 2017, we expect "More than Moore" to continue to play a leading role in moving the semiconductor industry forward. Die partitioning will continue as a means to both increase yields and reduce fabrication costs.

Wafer stacking technologies will be increasingly important in supporting fan-out packaging architectures such as systems in package (SiP). Wafer bonding will be key to driving these advances in stacking technology, where specialized carrier solutions will be mandatory to manufacture these devices.

Thomas Uhrmann, Director of Business Development
EV Group