Viewpoint
January 4, 2017

VIEWPOINT 2017: Luc Van den hove, CEO and President, imec



VIEWPOINT 2017: Luc Van den hove, CEO and President, imec
Luc Van den hove, CEO and President, imec
These last years, the explosive growth of data traffic has led to a demand for processing power beyond what is possible with traditional transistor scaling.

Additionally, the Internet of Things is growing into a veritable system of systems, demanding highly specialized functionality for e.g. low-power sensoring, security, or high-performance computing. But from what I see brewing in the labs today, I am confident that the industry will be able to develop the chips and systems for this new reality.

At imec in 2017, e.g. we will develop a pipeline of materials, device architectures and advanced techniques for a number of new technology generations. And we also look at higher system functions and see how we may create an optimized technology to implement these as efficiently as possible.

Making all these connected systems intelligent will also demand a sizable investment in application domain knowledge and digital technologies, and that is another opportunity for 2017 that I see for research centers like ours and for our industry as a whole.

Luc Van den hove, CEO and President
imec
http://www.imec.be
Free Newsletter Subscription
Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.

Insert Your Email Address