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Viewpoint Index

January 27, 2016

VIEWPOINT 2016: Greg Heras, Director of Sales, CoorsTek
VIEWPOINT 2016: Greg Heras, Director of Sales, CoorsTek
Greg Heras, Director of Sales, CoorsTek
The miniaturization movement and the rise in the use of copper wire have continued to drive innovations in the semiconductor packaging industry. CoorsTek Gaiser® has always been at the forefront of new technology development. In 2016, CoorsTek Gaiser proudly introduces the RF4 capillary finish, designed specifically to meet the unique challenges of copper wire bonding.

Employing an innovative, patent-pending process never before used in the manufacture of wire bonding tools, the RF4 is designed to perform on any existing package surfaces and materials.

The revolutionary finish provides lasting performance beyond current capillary designs, with excellent reliability and repeatability. With a fully engineered design, the RF4 maximizes control of force component vectors during bonding, offering optimized performance for LEDs and other advanced semiconductor products.

For over 40 years, industry leaders have relied on CoorsTek Gaiser for guaranteed peformance and unparalleled customer support. CoorsTek Gaiser offers a full line of ceramic bonding tools including capillaries, small and large wire wedges, and custom, made-to-order micromachined components.

With over 50 manufacturing locations across four continents, CoorsTek is the international partner of choice for high-performance semiconductor packaging tools. For more information, contact a CoorsTek Gaiser bonding tools expert today at +1.805.644.5583 or visit CoorsTek.com.

Greg Heras, Director of Sales