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| Viewpoint | ||
January 8, 2016
VIEWPOINT 2016: Rob Kavanagh, Global Business Director, Dow Electronic Materials
Materials development to address these challenges along with material selections by packaging houses are expected to ramp in 2016. Up until recently, FOWLP was largely a niche market application. However, if fan-out goes mainstream in mobile devices and smart phones as predicted, that would be a significant inflection point. Continued innovation remains critical for ongoing development of advanced wafer level packaging technologies, especially 3D-IC, which remains on the industry horizon. Innovations like SOLDERON™ BP TS 6000 Tin-Silver plating chemistry, which recently won an R&D 100 Award, are the type of materials needed for advanced semiconductor electronics devices. This lead-free material is optimized for fine-pitch solder bump plating applications, such as capped Cu pillars and micro-bumps, needed to drive performance and reliability in 2.5D and 3D-IC packaging technologies. Materials suppliers will need to support all these varied approaches in 2016. Flexibility will be needed to address the divergent applications as well as potential divergent approaches for each application. As history has shown us, a one-size-fits-all approach doesn't typically occur in advanced packaging and choices will be made based on performance, form factor and cost requirements ultimately. Rob Kavanagh, Global Business Director, Advanced Packaging Technologies Dow Electronic Materials https://www.dowelectronicmaterials.com |
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