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Viewpoint Index

January 8, 2016

VIEWPOINT 2016: Rob Kavanagh, Global Business Director, Dow Electronic Materials
VIEWPOINT 2016: Rob Kavanagh, Global Business Director, Dow Electronic Materials
Rob Kavanagh, Global Business Director, Advanced Packaging Technologies, Dow Electronic Materials
The key global trend forecasted in advanced packaging is a migration from fan-in to fan-out wafer-level packaging (FOWLP) to start in 2016 as a method of achieving high connectivity in a small space. With no substrate and thin-film metallization providing interconnections, redistribution layers patterned at finer feature sizes will be instrumental.

Materials development to address these challenges along with material selections by packaging houses are expected to ramp in 2016. Up until recently, FOWLP was largely a niche market application. However, if fan-out goes mainstream in mobile devices and smart phones as predicted, that would be a significant inflection point.

Continued innovation remains critical for ongoing development of advanced wafer level packaging technologies, especially 3D-IC, which remains on the industry horizon. Innovations like SOLDERON™ BP TS 6000 Tin-Silver plating chemistry, which recently won an R&D 100 Award, are the type of materials needed for advanced semiconductor electronics devices.

This lead-free material is optimized for fine-pitch solder bump plating applications, such as capped Cu pillars and micro-bumps, needed to drive performance and reliability in 2.5D and 3D-IC packaging technologies.

Materials suppliers will need to support all these varied approaches in 2016. Flexibility will be needed to address the divergent applications as well as potential divergent approaches for each application. As history has shown us, a one-size-fits-all approach doesn't typically occur in advanced packaging and choices will be made based on performance, form factor and cost requirements ultimately.

Rob Kavanagh, Global Business Director, Advanced Packaging Technologies
Dow Electronic Materials