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January 13, 2015

Thomas Sonderman, Vice President and General Manager, Software Business Unit, Rudolph Technologies
Thomas Sonderman, Vice President and General Manager, Software Business Unit, Rudolph Technologies
Thomas Sonderman, Vice President and General Manager, Software Business Unit, Rudolph Technologies
With new technologies like Cu Pillar becoming an integral part of emerging electronic products, 2015 promises to be an exciting year for the packaging industry.

To provide differentiated value to customers in the advanced packaging ecosystem, Rudolph Technologies plans to leverage its unique, leading-edge hardware and software platforms. These solutions provide exceptional value, and when combined, allow customers to solve even the most complex manufacturing challenges.

Rudolph's next-generation integrated fault detection and classification and yield management (FDC/YMS) platform will establish a new paradigm for isolating and correlating wafer defectivity to equipment-centric operational abnormalities.

When that FDC/YMS technology is combined with our state-of-the-art macro defect inspection tools, customers will achieve unprecedented levels of line monitoring and control.

In the coming year, we look forward to working with our industry partners as we continue to accelerate the evolution of semiconductor packaging technology.
Thomas Sonderman, Vice President and General Manager, Software Business Unit,
Rudolph Technologies