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January 8, 2015

Craig Mitchell, President, Invensas and CTO, Tessera
Craig Mitchell, President, Invensas and CTO, Tessera
Craig Mitchell, President, Invensas and CTO, Tessera
In the coming year, Invensas will continue to differentiate ourselves through our business model, which focuses on development of novel, high value-add packaging solutions. We then license and transfer these solutions to our customers and their partners for implementation in high-volume manufacturing.

Through this licensing model, we provide our licensees access to a broad portfolio of advanced packaging and interconnect technologies. In essence, we offer a toolbox that customers can pick and choose from, to use individually or in combination with other technologies, to meet the ever-evolving needs of the electronics market.

On the technology front, we are focused on package-level vertical integration to allow more performance, functionality and/or capacity to be delivered in a given space and, when done properly, more power efficiently and at a lower total cost.

In terms of products, Invensas is focused on the commercialization of our xFD(R) technology for DRAM through our collaborations with Micron and other DRAM manufacturers.

We hope to see initial products based upon this technology in the market in 2015. We will also advance our BVA(R) solution as both a fine pitch, package-on-package technology for smartphones, and more broadly as a high density vertical interconnect platform for integrating microelectronic sub-systems and modules. Finally, we are developing 2.5D and 3D IC technologies that address key process and integration challenges such as thin wafer handling and warpage.

In terms of industry trends, we expect that smartphones, tablets and other mobile devices will continue to drive high-volume advanced packaging requirements. We also anticipate continued increases in interconnect density through finer pitch flip-chip, package-on-package, and wafer-level packages, particularly fan-out wafer-level packages.

Finally, we expect to see some 2.5D and 3D IC-based components, for example, 3D DRAM, gaining traction in high-end server and high-performance computing applications.
Craig Mitchell, CTO