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January 7, 2015
Denny McGuirk, President and CEO, SEMIPackaging technology is critical in achieving the device performance needed in many applications, and this is especially true for the small, thin form factor demanded in mobile electronics. Such applications require wafer-level packaging (WLP), stud-bump flip chip packaging, and, increasingly, 3D packaging solutions. Materials are a key enabler of new packaging solutions, and SEMI estimates that the packaging materials market will grow to over US$ 21 billion in 2015. The Southeast Asia region will spend the most ($5.5 billion) while Taiwan and China will spend over $4 billion each. SEMI continues to advance the industry by providing market information, international standards, advocacy, and exhibitions and programs for collaboration on all of the important challenges facing the industry. SEMI is expanding its programs. In 2014, SEMI launched a Semiconductor Strategy Summit in both Buenos Aires and Ho Chi Minh City to provide business platforms in these emerging regional markets. The new SEMICON Southeast Asia will rotate between Singapore and Penang while SEMICON Europa will rotate between Dresden and Grenoble. SEMI expositions in the U.S., China, Taiwan, Japan, Korea, and Russia continue to be vital gatherings for the industry. SEMI offers market research and data on semiconductor equipment, materials, fabs/foundries, packaging, HB LEDs, PV, and more. The SEMI International Standards program has more than 4,600 volunteer experts with 1,700+ companies represented. Currently, SEMI has 21 global technical committees and 200 task forces worldwide. SEMI members have access to a "Members Only" website and many webinars and presentations files are available. For more information on SEMI, please visit www.semi.org. Denny McGuirk, President and CEO SEMI http://www.semi.org |
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