January 31, 2014
Doug Goodman, CEO, Ridgetop Group, Inc.
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Doug Goodman, CEO, Ridgetop Group, Inc.
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As process geometries shrink further, process variations and
drift issues compound the problems facing IC designers. For example, how are device lifetimes
estimated for a 14nm FinFET? How can
fabless semiconductor firms obtain fast NBTI data? How can I be assured that my
design is centered against worst-case environmental conditions? Which foundry is better for my IC, foundry A
or foundry B? Should I rely on the
foundry Process Design Kit (PDK) for all my information?
The answer is that standard PDKs fall short in providing all
information to provide a robust design. One size does not fit all. To
obtain information beyond the PDK, the conventional approach would be to
assemble a rack and stack instrument configuration, write some software, use
temperature cycling chambers and wait months for results.
Ridgetop's differentiated approach with our ProChek Characterization
System has rethought the entire parameter extraction process, in order to
create a user-friendly, desktop instrument that provides statistically-sound
samples of 32 to 1024 devices on a test coupon using the targeted IC foundry
process. ProChek is differentiated from
conventional approaches, and puts the power of information in the hands of the
designer.
As our markets move fast, answers must come faster. Novel, unconventional products provide this
required capability. Differentiated
products give IC designers the edge!
Doug Goodman, CEO
Ridgetop Group, Inc.
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