Viewpoint
January 20, 2014

Robert Nead, President, i3 Electronics, Inc



Robert Nead, President, i3 Electronics, Inc
Robert Nead, President, i3 Electronics, Inc
2013 was a year of fresh starts and new opportunities for i3 Electronics, Inc. On November 1, 2013 we acquired all of the assets of Endicott Interconnect Technologies enabling us to re-enter the marketplace a stronger and more financially sound company.

I believe that 2014 has the potential to be a great year for our company and the industry in general. i3 will continue to offer all of the cutting-edge products that Endicott Interconnect previously manufactured including: printed circuit boards, 1st & 2nd level assembly, semiconductor packaging, systems integration, design services, advanced R&D, and laboratory services.

We expect strong growth in the medical and commercial markets, and we have tailored our business development strategy accordingly to meet the increasing demands of these market segments. At the same time as more and more companies look for US based high-tech, electronics manufacturers, i3 has positioned itself as a market leader, ready to tackle new challenges.

Our commitment to advanced technology and high-quality products will enable us to provide our customers with a complete design and manufacturing solution not only in 2014 but for many years to come.

Robert Nead, President
i3 Electronics, Inc
http:/www.i3electronics.com
Free Newsletter Subscription
Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.

Insert Your Email Address