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Viewpoint Index

January 13, 2014

Michael S. Boger, Global Market Sector Manager, Edwards

Michael S. Boger, Global Market Sector Manager, Edwards
Michael S. Boger, Global Market Sector Manager, Edwards
Semiconductor manufacturers will continue to move toward the use of more complex packaging technologies as they strive to put greater power and functionality in less space. The trend to increasing complexity and 3D processing can be considered one of the "More than Moore" trends referenced in the International Technology Roadmap for Semiconductors.

New packaging processes are expected to increase the use of vacuum-based processing tools for material deposition and removal, including PVD, CVD, and DRIE. Importantly, much of this processing is likely to take place at outsourced assembly and test operations that are new to these technologies and lack the deep knowledge and long experience with these tools and processes possessed by major IDMs and foundries.

Decisions made regarding the initial design and configuration of the vacuum systems, as well as operational and maintenance practices can have a significant impact on total cost of ownership and profitability.

One of the most important decisions a company can make in bringing these new technologies into production is choosing a vacuum systems provider that offers both state-of-the-art products and the knowledge and support required to ensure their efficient integration in a high-volume production environment.

Michael S. Boger, Global Market Sector Manager
Edwards