January 13, 2014
Michael S. Boger, Global Market Sector Manager, Edwards
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Michael S. Boger, Global Market Sector Manager, Edwards
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Semiconductor manufacturers will continue to move toward the
use of more complex packaging technologies as they strive to put greater power
and functionality in less space. The trend to increasing complexity and 3D
processing can be considered one of the "More than Moore" trends referenced in
the International Technology Roadmap for Semiconductors.
New packaging
processes are expected to increase the use of vacuum-based processing tools for
material deposition and removal, including PVD, CVD, and DRIE. Importantly,
much of this processing is likely to take place at outsourced assembly and test
operations that are new to these technologies and lack the deep knowledge and
long experience with these tools and processes possessed by major IDMs and
foundries.
Decisions made regarding the initial design and configuration of the
vacuum systems, as well as operational and maintenance practices can have a
significant impact on total cost of ownership and profitability.
One of the
most important decisions a company can make in bringing these new technologies into
production is choosing a vacuum systems provider that offers both state-of-the-art
products and the knowledge and support required to ensure their efficient integration
in a high-volume production environment.
Michael S. Boger, Global Market Sector Manager
Edwards
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