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February 20, 2013

Dan Donabedian, CEO, Ziptronix, Inc.

Dan Donabedian, CEO, Ziptronix, Inc.
Dan Donabedian, CEO, Ziptronix, Inc.
One overriding message of the recent Consumer Electronics Show in Las Vegas is that consumers expect smartphones to be fast, powerful, versatile and small -- and have a battery that lasts all day.  These features, along with device heat-dissipation requirements, are major drivers in the semiconductor industry.

Smartphone users' appetite for data over their devices also means that huge amounts of data must be stored remotely in data centers, because shrinking device sizes clearly cannot accommodate it.

Ziptronix is addressing all these requirements on several fronts. We have developed and licensed technology surrounding 3D wafer bonding for applications such as BSI image sensors and RF front-ends, both of which have had a large impact in enabling consumer electronics to perform better at smaller sizes.

In late 2012, Ziptronix licensed its technology to Tezzaron, a company that designs and produces true three-dimensional integrated circuits (3D ICs). These 3D ICs are vertically interconnected with built-in through-silicon vias (TSVs) so that the separate layers function together as a single circuit, vastly increasing density and speed, while using less power. Tezzaron also uses Ziptronix's technology to build patented ultra-high-speed memory products that are used for many different applications, including the data centers mentioned above.

In January, Ziptronix announced a licensing agreement with Novati, a foundry that recently added capabilities such as the manufacturing and assembly of leading-edge 3D ICs. These capabilities will enable companies to have access to some of the newest, most advanced technologies that will contribute to advances in microelectronics -- and to the performance features that smartphone users increasingly expect

Dan Donabedian, CEO
Ziptronix, Inc.