February 20, 2013
Dan Donabedian, CEO, Ziptronix, Inc.
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Dan Donabedian, CEO, Ziptronix, Inc.
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One
overriding message of the recent Consumer Electronics Show in Las Vegas is that
consumers expect smartphones to be fast, powerful, versatile and small -- and
have a battery that lasts all day. These
features, along with device heat-dissipation requirements, are major drivers in
the semiconductor industry.
Smartphone users' appetite for
data over their devices also means that huge amounts of data must be stored
remotely in data centers, because shrinking device sizes clearly cannot
accommodate it.
Ziptronix
is addressing all these requirements on several fronts. We have developed and
licensed technology surrounding 3D wafer bonding for applications such as BSI
image sensors and RF front-ends, both of which have had a large impact in
enabling consumer electronics to perform better at smaller sizes.
In late
2012, Ziptronix licensed its technology to Tezzaron, a company that designs and produces true three-dimensional integrated
circuits (3D ICs). These 3D ICs are vertically interconnected with built-in through-silicon
vias (TSVs) so that the separate layers function together as a single circuit,
vastly increasing density and speed, while using less power. Tezzaron also uses
Ziptronix's technology to build patented ultra-high-speed memory products that are
used for many different applications, including the data centers mentioned
above.
In
January, Ziptronix announced a licensing agreement with Novati, a foundry that
recently added capabilities such as the manufacturing and assembly of
leading-edge 3D ICs. These capabilities will enable companies to have access to
some of the newest, most advanced technologies that will contribute to advances
in microelectronics -- and to the performance features that smartphone users
increasingly expect
Dan Donabedian, CEO
Ziptronix, Inc.
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