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Copper pillar technology brings several benefits, including reduced pitch and improved electrical performance. Devices utilizing copper pillar technology have more interconnects per surface area resulting in tighter pitch and lower standoffs heights.
As standoff height reduces, flux residues have less area to outgas during reflow. For that reason, there is a critical need to investigate the conditions that would be required to successfully remove flux residues to ensure the functionality and reliability of the final product.
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ZESTRON Academy's complimentary technical webinar series provides valuable knowledge on the newest advancements and trends within the Advanced Packaging and Power Electronics sector.
Attendees will be enlightened on important subjects such as "Tackling Flux Residues: Best Practices for Cleaning Power Electronics Components" and "Corrosion in Power Electronics."
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ZESTRON Corporation, 11285 Assett Loop, Manassas, Virginia, 20109 United States
(703) 393-9880
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