Complete Warpage Control for Wafers and Panels

Effective warpage mitigation has become increasingly critical for today’s semiconductor advanced packaging applications, such as fan-out. To address this growing challenge, Heller Industries has developed a unique and effective solution for mitigating warpage during mass reflow which utilizes a system of recirculating vacuum chucks. These systems are:
  • Designed for use with in-line horizontal reflow ovens for maximum UPH
  • Compatible with full automation
  • Cleanroom compatible up to Class 100
  • Compatible with formic acid for flux-free processing


This paper discusses Heller Industries new warpage control system for wafers and panels. Visit Heller Industries to learn more, or click here to schedule an online presentation.

Download technical paper on wafer and panel warpage mitigation.

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