semiconductor
packaging news
Sponsor
MicroCircuit-Laboratories-LLC

FSO and LiDAR hermetic microelectronic miniature packages
Largest area lenses in covers are routine for Robotic Cover Sealer with Automated Processing. Robotic Materials Manager provides walk away automation.
MicroCircuit Laboratories, LLC
Ontos-Equipment-Systems
Press Release
November 12, 2025  -  Click the title to read the full press release.

SCHMID Group secures major orders for PLP and mSAP production equipment



SCHMID Group announced the successful acquisition of two significant orders in the fast-growing field of Panel Level Packaging and mSAP production Equipment. In one project, SCHMID ...

SCHMID Group
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Sponsor
Nordson-ASYMTEK

Large Capacity Plasma Treatment System - FlexTRAK-SHS
9.6-liter plasma process chamber handles larger, or more, strips increasing throughput and productivity for electronics/semiconductor packaging.
Nordson Electronics Solutions
kyzen