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Epoxy for Dam-and-Fill Applications
Master Bond EP17HTDM-2 Black is a high temperature resistant, non-drip adhesive for bonding, sealing, encapsulating and dam-and-fill applications.
Master Bond
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| Press Release |
July 1, 2025 - Click the title to read the full press release.
Strengthening the European electronics industry through targeted support for innovative technologies and advanced manufacturing processes: This is the aim of the pilot ...
Fraunhofer IMWS
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Automatic Grading Without Assistance
Eliminate the need for operators to assess bond testing failure modes at the end of an automation run. Auto grading uses machine vision software to process the test result images.
xyztec
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