semiconductor
packaging news
Sponsor
Pac-Tech

A study about 3D stacking of passive SMD elements
This study demonstrates laser assisted bonding (LAB) of SMD Tantal Elko and MLCC capacitors and presents a comparison to conventional bonding using solder paste and reflow oven.
PacTech
Master-Bond
Press Release
June 10, 2025  -  Click the title to read the full press release.

FAMES Pilot Line Launches FAMES Academy



The FAMES Pilot Line announced the official launch of the FAMES Academy, a strategic educational initiative designed to support the EU's commitment to develop ...

FAMES
Free Newsletter Subscription
Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.

Insert Your Email Address

Sponsor
BTU-International

TrueFlat by BTU: Ensuring Consistent Flatness in Every Reflow Cycle.
BTU presents the Pyramax TrueFlat reflow oven. Say goodbye to substrate warpage and hello to reliable, repeatable flatness. Discover the TrueFlat advantage now!
BTU International
QPT