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Die-Module Attach (Pastes & Films)
Die-Attach Adhesives with low moisture absorption for MSL Level-1 applications for reliability. Outstanding thermal conductivity with low moisture absorption- stress-free bonding.
AI Technology, Inc.
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| Press Release |
April 15, 2025 - Click the title to read the full press release.
Heraeus Electronics will highlight its latest advancements in high-reliability materials for power electronics through a series of live presentations at PCIM Europe 2025, scheduled ...
Heraeus Electronics
April 15, 2025
Heraeus Electronics to Debut New Die Top System Material at PCIM Europe 2025
Heraeus Electronics will highlight its latest advancements in high-reliability materials for power electronics through a series of live presentations at PCIM Europe 2025, scheduled ...
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June 26, 2024
Heraeus Electronics Joins EU-Funded Project FastLane to Accelerate Future of Sustainable Power Electronics
Heraeus Electronics is proud to announce its participation in the FastLane project, an ambitious EU-funded initiative aimed at revolutionizing the European value chain ...
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June 12, 2024
Heraeus Successfully Defends Patent for Metal Sintering
Heraeus Electronics GmbH & Co KG announces the successful defense of its key European patent no. EP 3215288 B1. This patent encompasses ...
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May 23, 2024
Heraeus Electronics to Debut New Silver Sinter Paste for Module Attach Applications at PCIM Europe
Heraeus Electronics will introduce its latest product innovation, the mAgic PE360 Silver Sinter Paste, in Hall 6, Booth 6-310 at PCIM Europe. The event will take place June 11-13 ...
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April 4, 2024
Heraeus Electronics Hosts ALL2GaN Event Showcasing Advances in High-Efficiency Power Electronics
Heraeus Electronics is proud to announce that it will host an upcoming ALL2GaN event from April 9-10, 2024, at its facilities in Hanau. This event will focus on the groundbreaking ...
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March 6, 2024
Heraeus Printed Electronics and SUSS MicroTec Join Forces to Revolutionize High-Volume Semiconductor Manufacturing
Heraeus Printed Electronics GmbH and SUSS MicroTec have announced the signing of a Joint Development Agreement (JDA) to pave the way for digital inkjet printing of metallic ...
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February 27, 2024
VIEWPOINT 2024: David Malanga, Director of Marketing and Sales – Americas, Heraeus Electronics
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February 5, 2024
Heraeus Electronics Thick Film Expands Its Portfolio through Acquisition of PriElex Electronic
Heraeus Electronics is pleased to announce the successful acquisition of the PriElex electronics inks business line from Kayaku Advanced Materials Inc. The acquisition, effective ...
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November 28, 2023
Heraeus Electronics Wins 2023 GLOBAL Technology Award for Solder Alloy Innovation
Heraeus Electronics is proud to announce its receipt of the prestigious 2023 GLOBAL Technology Award in the category of Solder Paste. The award highlights the contribution ...
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September 13, 2023
Heraeus Joins Aachen Semiconductor Start-Up Aixscale
The technology and family-owned company Heraeus is joining the Aachen-based start-up ...
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Proven SiPaste® for Ultrafine Printing
Boost SPI yields with SiPaste® C201HF. Formulated for fine feature printing, it combines superior non-wet open performance with excellent stencil print transfer efficiency.
Indium Corporation
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