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AI-Technology-Inc

Die-Module Attach (Pastes & Films)
Die-Attach Adhesives with low moisture absorption for MSL Level-1 applications for reliability. Outstanding thermal conductivity with low moisture absorption- stress-free bonding.
AI Technology, Inc.
ECTC
Press Release
April 14, 2025  -  Click the title to read the full press release.

From Extreme Heat to Orbit: StratEdge Displays RF and High-Power Solutions at iMAPS HiTEC and CMSE



StratEdge Corporation announces that it will be showcasing its latest advancements in high-temperature packaging technology at the iMAPS HiTEC Power Packaging ...

StratEdge Corporation
April 14, 2025
From Extreme Heat to Orbit: StratEdge Displays RF and High-Power Solutions at iMAPS HiTEC and CMSE
StratEdge Corporation announces that it will be showcasing its latest advancements in high-temperature packaging technology at the iMAPS HiTEC Power Packaging ...
February 26, 2025
StratEdge Powers Up for 2025: Showcasing Latest Molded Ceramic Packages at IMAPS and GOMACTech
StratEdge Corporation will reveal its newest molded ceramic package configurations at two premier events this March: the IMAPS Device Packaging Conference and the GOMACTech ...
January 23, 2025
StratEdge Corporation Partners with Vitale Engineering as Manufacturer's Representative
StratEdge Corporation has appointed Vitale Engineering as its exclusive Manufacturer’s Representative for Upstate New York. Known for their customer-focused approach ...
January 15, 2025
VIEWPOINT 2025: Casey Krawiec, VP of Global Sales, StratEdge Corporation
November 26, 2024
StratEdge Wins Prestigious IMAPS 2024 Corporate Recognition Award
StratEdge Corporation is proud to announce that it has been awarded the 2024 IMAPS Corporate Recognition Award. The prestigious award was presented on October 1, 2024 ...
November 6, 2024
Coastal RF Systems Joins StratEdge's Network as Manufacturer's Rep for Southern California
StratEdge Corporation has appointed Coastal RF Systems as its exclusive Manufacturer's Representative for Southern California. This strategic partnership is set to extend ...
October 24, 2024
Unlock Unmatched Performance for Matched Impedance Devices with StratEdge at IEEE BCICTS 2024
StratEdge Corporation is excited to announce its participation in the IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium (BCICTS) ...
October 22, 2024
Unlock Unmatched Performance for Matched Impedance Devices with StratEdge at IEEE BCICTS 2024
StratEdge Corporation is excited to announce its participation in the IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium (BCICTS), ...
September 13, 2024
StratEdge Semiconductor Packages Set to Take the Spotlight at European Microwave Week and IMAPS Symposium
StratEdge Corporation announces that it will be exhibiting in booth 923B at European Microwave Week (EuMW), being held at Porte de Versailles Paris, France from September ...
August 27, 2024
StratEdge Brings Gold Medal Performance with its Ceramic Packages and High-reliability Assembly Services
StratEdge Corporation is redefining the landscape of semiconductor packaging with its cutting-edge molded and post-fired ceramic packages, supported by industry-leading ...
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Indium-Corporation

Proven SiPaste® for Ultrafine Printing
Boost SPI yields with SiPaste® C201HF. Formulated for fine feature printing, it combines superior non-wet open performance with excellent stencil print transfer efficiency.
Indium Corporation
Pac-Tech