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EV-Group

IR Layer Release Technology for 3D Packaging and Logic Scaling
Ultra-thin layer transfer from silicon carriers with nanometer precision using an IR laser and inorganic release layers revolutionizes 3D packaging & logic scaling.
EV Group
SEMI
Press Release
March 11, 2025  -  Click the title to read the full press release.

STMicroelectronics reveals solutions for post-quantum cryptography



STMicroelectronics has introduced hardware cryptographic accelerators and associated software libraries for general-purpose and secure microcontrollers, ready for future ...

STMicroelectronics
March 14, 2025
65W GaN converter delivers space-saving power for cost-conscious applications
ST's VIPerGaN65D flyback converter, with its SOIC16 outline, permits extremely small and economical power supplies, adapters, and USB-PD (Power Delivery) fast chargers ...
March 11, 2025
STMicroelectronics reveals solutions for post-quantum cryptography
STMicroelectronics has introduced hardware cryptographic accelerators and associated software libraries for general-purpose and secure microcontrollers, ready for future ...
March 6, 2025
STMicroelectronics' STM32WBA6 combine extra features and performance with power efficiency
STMicroelectronics has announced the next generation of its STM32 power-efficient short-range wireless microcontrollers (MCUs) that simplify connecting consumer and industrial ...
February 28, 2025
Simple, efficient, flexible 1A buck converter powers low-voltage loads
ST's DCP3601 miniature monolithic buck converter combines extensive feature integration and flexibility, enabling simple, low-BOM designs to achieve high conversion efficiency. ...
February 25, 2025
Advanced 2-in-1 MEMS accelerometer in one IMU for intensive impact
ST's innovative LSM6DSV80X combines two accelerometer structures for 16 g and 80 g full-scale sensing, a gyroscope up 4000 dps, and embedded intelligence in a single ...
February 21, 2025
STMicroelectronics to enable higher-performance cloud optical interconnect in datacenters and AI clusters
STMicroelectronics is unveiling its next generation of proprietary technologies for higher-performing optical interconnect in datacenters and AI clusters. With the exponential ...
February 20, 2025
Latest STM32C0 MCUs ease entry into embedded development
Three new microcontrollers (MCUs) are joining the STM32C0 series, giving designers more flexibility with options including greater memory density, extended interfaces ...
February 5, 2025
STMicroelectronics and HighTec EDV-Systeme collaborate for safer software-defined vehicles
STMicroelectronics and HighTec EDV-Systeme GmbH are advancing automotive functional safety with a complete solution that will accelerate the development of safety-critical ...
January 28, 2025
Upgraded sensor board accelerates plug-and-play evaluation with ST MEMS Studio
Developing context-aware applications with MEMS sensors is faster, more powerful, and more flexible with ST’s latest-generation sensor evaluation board, the STEVAL-MKI109D. ...
January 27, 2025
New NFC reader IC and comprehensive modular kit jumpstarts contactless designs
ST is making it easier to explore creative applications for contactless near-field communication (NFC) technology with a novel development kit featuring the new ST25R200 ...
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Camtek-USA-Inc

Multi-Sensor Metrology
Users want to measure various applications on one tool rather than several tools to get the required results. Ultra-precise, non-contact measuring techniques work for packaging applications.
Camtek
SEIKA-America