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Sponsor
EV-Group

IR Layer Release Technology for 3D Packaging and Logic Scaling
Ultra-thin layer transfer from silicon carriers with nanometer precision using an IR laser and inorganic release layers revolutionizes 3D packaging & logic scaling.
EV Group
SEMI
Press Release
March 11, 2025  -  Click the title to read the full press release.

ASML and imec sign strategic partnership agreement



ASML Holding N.V. (ASML) and imec announce that they have signed a new strategic partnership agreement, focusing on research and sustainability. The agreement has a ...

Imec
March 21, 2025
Imec and ZEISS intensify collaboration with the signing of a new Strategic Partnership Agreement
Imec and ZEISS Semiconductor Manufacturing Technology (SMT) are intensifying their collaboration to advance the NanoIC pilot line at imec with state-of-the-art semiconductor ...
March 19, 2025
Imec honors Apple's Johny Srouji with the 2025 Innovation Award
Imec announced that Johny Srouji, Apple's senior vice president of hardware technologies, will receive the 2025 imec Innovation Award. The award recognizes Srouji's pivotal ...
March 11, 2025
ASML and imec sign strategic partnership agreement
ASML Holding N.V. (ASML) and imec announce that they have signed a new strategic partnership agreement, focusing on research and sustainability. The agreement has a ...
February 25, 2025
Imec demonstrates electrical yield for 20nm pitch metal lines obtained with High NA EUV single patterning
This week at SPIE Advanced Lithography + Patterning, imec presents the first electrical test (e-test) results obtained on 20nm pitch metal line structures patterned after ...
January 13, 2025
First full wafer-scale fabrication of electrically-pumped GaAs-based nano-ridge lasers
Imec has announced a significant milestone in silicon photonics with the successful demonstration of electrically-driven GaAs-based multi-quantum-well nano-ridge laser ...
December 12, 2024
Imec proposes double-row CFET for the A7 technology node
This week, at the 2024 IEEE International Electron Devices Meeting (IEDM), imec presents a new CFET-based standard cell architecture containing two rows of CFETs with ...
October 17, 2024
Imec invites the global automotive ecosystem to commit to join imec's Automotive Chiplet Program
At an exclusive gathering in Detroit (MI), bringing together the global automotive ecosystem to discuss the evolution towards chiplets in cars (Automotive Chiplet Forum 2024), ...
August 12, 2024
Imec demonstrates logic and DRAM structures using High NA EUV Lithography
Imec presents patterned structures obtained after exposure with the 0.55NA EUV scanner in the joint ASML-imec High NA EUV Lithography Lab in Veldhoven, the Netherlands. ...
August 7, 2024
Imec Adds New Hyperspectral Sensor to its Portfolio
This week, at the Small Satellite conference 2024 in Utah, imec adds a new hyperspectral sensor to its portfolio, addressing space applications. The new hyperspectral sensor ...
July 29, 2024
Imec achieves record-low charge noise for Si MOS quantum dots fabricated on a 300mm CMOS platform
Imec announced the demonstration of high quality 300mm-Si-based quantum dot spin qubit processing with devices resulting in a statistically relevant, average charge ...
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Sponsor
Camtek-USA-Inc

Multi-Sensor Metrology
Users want to measure various applications on one tool rather than several tools to get the required results. Ultra-precise, non-contact measuring techniques work for packaging applications.
Camtek
SEIKA-America