| Press Release |
March 11, 2025 - Click the title to read the full press release.
Traditionally, surface mounting components on double-sided printed circuit boards (PCBs) requires adhesive on at least one side to keep the components in place during ...
AI Technology
March 18, 2025
New Solvent-Free, Waterborne Conformal Coating Provides Superior Corrosion Protection for PCBs
In the ever-evolving world of technology, highper-formance printed circuit boards (PCBs) play a crucial role in powering our devices. However, these more advanced electronic ...
|
March 11, 2025
AI Technology Launches a Novel SAC-Based TLPS Solder Paste
Traditionally, surface mounting components on double-sided printed circuit boards (PCBs) requires adhesive on at least one side to keep the components in place during ...
|
January 6, 2025
AI Technology Completes Strategic Acquisition of Ormet Circuits Inc.
AI Technology (AIT) is pleased to announce the successful completion of its acquisition of Ormet Circuits Inc. (Ormet) from EMD Electronics, the U.S. and Canada Electronics ...
|
October 7, 2016
Get a FREE sample of Globtops/Underfills! Visit AiT at IMAPS
Stop by our booth (#116) to discuss your free sample FREE Glob-top and Underfill samples specially tailored to your project! Promotional offering good through ...
|
August 22, 2016
Temporary Bonding Adhesive for Thin Wafer Handling
What do you use to handle thin wafers and thin reconstituted wafers? Increasingly miniaturized electronic devices require decreased profile heights, reduced...
|
January 16, 2015
Rich Amigh, Sales & Marketing Manager, AI Technology, Inc.
AI Technology, Inc. (AIT) will continue expanding and improving our Die Attach Film (DAF) adhesives to meet the demands of our customers in 2015. Many leading edge companies designing memory chips, microprocessors, medical devices, RF and MW type products have been impressed with AIT’s DAF, which provides high melt-flow and high thermal and electrical conductivity for low thermal and electrical interface resistance ...
|
May 8, 2014
Recent Advances in Die Attach Film
Wafer level die attach film with very thin bond line has many challenges. Advances in die attach materials and optimized processing conditions overcome these challenges and ...
|
|
Free Newsletter Subscription
Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.
Insert Your Email Address
|
| Sponsor |
|
Multi-Sensor Metrology
Users want to measure various applications on one tool rather than several tools to get the required results. Ultra-precise, non-contact measuring techniques work for packaging applications.
Camtek
|
|
|
