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Sponsor
Pac-Tech

A study about 3D stacking of passive SMD elements
This study demonstrates laser assisted bonding (LAB) of SMD Tantal Elko and MLCC capacitors and presents a comparison to conventional bonding using solder paste and reflow oven.
PacTech
Master-Bond
Press Release
November 25, 2024  -  Click the title to read the full press release.

Flexible, space-saving class-D amplifier for in-car audio adds automotive-optimized diagnostics



The HFA80A automotive-grade analog-input class-D audio amplifier combines high efficiency, small size, and a low bill of materials, with load diagnostics optimized for automotive ...

STMicroelectronics
June 11, 2025
Revealing space-saving, high-frequency digital automotive audio amplifiers for smart-cockpit applications
STMicroelectronics has revealed new class-D automotive audio amplifiers for smart-cockpit applications, engineered for tiny overall dimensions and with a digital input that ...
June 6, 2025
STMicroelectronics announces mass production and lead customer success for turnkey Bluetooth/Wi-Fi modules
STMicroelectronics has announced mass-production start for its ST67W611M1 combined Wi-Fi 6 and Bluetooth Low Energy 5.4 module, describing the early success of Siana ...
June 5, 2025
New gate drivers featured for brushless control in cordless appliances, mobile robots, and industrial drives
STMicroelectronics has introduced the STDRIVE102H and STDRIVE102BH, beginning a new generation of integrated gate drivers for three-phase brushless motors to boost ...
June 2, 2025
Compact, configurable automotive driver adds safety pins
The L9026 8-channel driver from STMicroelectronics has six configurable high-side/low-side outputs and two high-side outputs, delivering a flexible solution in a choice ...
May 30, 2025
Integrated matching filters for STM32WL33 wireless microcontrollers
STMicroelectronics has released a set of antenna-matching companion chips for STM32WL33 wireless microcontrollers (MCUs) to simplify the development of IoT, smart-metering ...
May 28, 2025
STMicroelectronics' modular IO-Link development kit eases creation of device nodes
STMicroelectronics has released an IO-Link development kit that simplifies building actuators and sensors by providing all necessary hardware and software, including an actuator ...
May 23, 2025
STMicroelectronics completes GSMA certification for ST4SIM-300 eSIM for IoT
STMicroelectronics has completed certification of its ST4SIM-300 embedded SIM (eSIM) to GSMA SGP.32 eSIM IoT specification. Certification assures interoperability ...
May 19, 2025
Latest GaN half-bridge drivers for power conversion and motion control
The latest STDRIVEG610 and STDRIVEG611 give designers two options to manage GaN devices in power conversion and motion applications for greater efficiency, power ...
May 16, 2025
STMicroelectronics combines activity tracking and high-impact sensing
STMicroelectronics has revealed an inertial measurement unit that combines sensors tuned for activity tracking and high-g impact measurement in a single, space-saving ...
May 2, 2025
Automotive gate driver enables scalable and high-performance EV-powertrain designs
STMicroelectronics' STGAP4S galvanically isolated automotive gate driver for SiC MOSFETs and IGBTs gives flexibility to control inverters of different power ratings featuring ...
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Sponsor
BTU-International

TrueFlat by BTU: Ensuring Consistent Flatness in Every Reflow Cycle.
BTU presents the Pyramax TrueFlat reflow oven. Say goodbye to substrate warpage and hello to reliable, repeatable flatness. Discover the TrueFlat advantage now!
BTU International
QPT