semiconductor
packaging news
Sponsor
Pac-Tech

A study about 3D stacking of passive SMD elements
This study demonstrates laser assisted bonding (LAB) of SMD Tantal Elko and MLCC capacitors and presents a comparison to conventional bonding using solder paste and reflow oven.
PacTech
Master-Bond
Press Release
November 1, 2024  -  Click the title to read the full press release.

Koh Young Earns Industry's Highest Customer Service Award Again



Koh Young Technology has been honored with the 2024 Service Excellence Award from Circuits Assembly—marking the third time in four years the company has achieved ...

Koh Young Technology
May 7, 2025
Koh Young Invites You to the 2025 IEEE ECTC
Koh Young invites you to join us at the 2025 IEEE Electronic Components and Technology Conference (ECTC), taking place May 27–30, 2025, at the Gaylord Texan Resort ...
March 27, 2025
Koh Young presenting at SEMI Heartland
Koh Young is pleased to announce that Luis Rivera, MES Team Leader at Koh Young America, will speak at SEMIEXPO Heartland 2025, taking place March 31 to April 2 ...
March 6, 2025
Koh Young expands with EAP, Inc.
Koh Young America is pleased to announce the addition of Electronic Assembly Products, Inc. (EAP) as its sales representative for Colorado and Utah, effective March 3 ...
February 27, 2025
Koh Young America Appoints MaRC Technologies as its Sales Rep for Pacific Northwest
Koh Young America is pleased to announce the addition of MaRC Technologies as its sales representative for the Pacific Northwest region, effective February 24, 2025. MaRC ...
February 3, 2025
Koh Young Partners with NTV USA
Koh Young is excited to announce its partnership with NTV USA (NexTex Ventures, LLC) to bring its proven inspection technologies to the semiconductor industry. With more ...
January 8, 2025
VIEWPOINT 2025: Brent A. Fischthal, Head of Global Marketing, Koh Young America, Inc.
The semiconductor and advanced packaging industry is entering a time where precision and reliability are no longer just goals—they are prerequisites for success. As manufacturers strive to meet the demands of next-generation technologies, achieving higher yield and operational efficiency has become a cornerstone ...
December 3, 2024
Koh Young Technology Showcasing Advanced Packaging Inspection Solutions at SEMICON Japan
Koh Young Technology will demonstrate its award-winning inspection solutions in Hall 1 Booth 1310 at Tokyo Big Sight on December 12-13, 2024. Our team of experts will ...
December 2, 2024
Koh Young Honored by Foxconn with 2024 Digital Ecosystem Partner Award
Koh Young Technology is proud to announce that Foxconn honored us on November 15, 2024, with its prestigious 2024 Digital Ecosystem Partner Award. This accolade underscores ...
November 1, 2024
Koh Young Earns Industry's Highest Customer Service Award Again
Koh Young Technology has been honored with the 2024 Service Excellence Award from Circuits Assembly—marking the third time in four years the company has achieved ...
October 24, 2024
Koh Young Technology Showcasing its Inspection Solutions at electronica and SEMICON Europa
Koh Young Technology will demonstrate its award-winning inspection solutions at Messe München on November 12-15, 2024. At electronica Booth A3.358, our team of experts ...
Free Newsletter Subscription
Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.

Insert Your Email Address

Sponsor
BTU-International

TrueFlat by BTU: Ensuring Consistent Flatness in Every Reflow Cycle.
BTU presents the Pyramax TrueFlat reflow oven. Say goodbye to substrate warpage and hello to reliable, repeatable flatness. Discover the TrueFlat advantage now!
BTU International
QPT