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A study about 3D stacking of passive SMD elements
This study demonstrates laser assisted bonding (LAB) of SMD Tantal Elko and MLCC capacitors and presents a comparison to conventional bonding using solder paste and reflow oven.
PacTech

Press Release

August 1, 2024 - Click the title to read the full press release.

Microelectronics Commons Hubs Build Partnerships to Advance Semiconductor Re-Onshoring Efforts

The Microelectronics Commons is responding to the call for an infrastructure that will enable a sustainable dome stic innovation pipeline. A critical piece of the Microelectronics ...

NSTXL

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Sponsor

TrueFlat by BTU: Ensuring Consistent Flatness in Every Reflow Cycle.
BTU presents the Pyramax TrueFlat reflow oven. Say goodbye to substrate warpage and hello to reliable, repeatable flatness. Discover the TrueFlat advantage now!
BTU International