Press Release |
July 31, 2024 - Click the title to read the full press release.
Promex Industries and its San Diego-based division QP Technologies announced a sales/marketing reorganization aimed at growing both companies’ core businesses. As part ...
QP Technologies
January 22, 2025
VIEWPOINT 2025: Matt Hansen, VP, Sales and Marketing, QP Technologies
|
July 31, 2024
Promex Industries and QP Technologies Implement Sales/Marketing Reorganization
Promex Industries and its San Diego-based division QP Technologies announced a sales/marketing reorganization aimed at growing both companies’ core businesses. As part ...
|
July 1, 2024
Custom Substrates Enable Fast-Turn Package, Assembly Development
Chip designers can leverage custom substrates to quickly develop optimal packaging and assembly solutions for high-speed, high-performance devices, overcoming time-to-market challenges.
|
June 25, 2024
QP Technologies Expands Die Preparation Business
QP Technologies announced it has added a state-of-the-art dicing saw to its manufacturing line, expanding its die and wafer preparation business. The Disco DFD6362 ...
|
April 17, 2024
QP Technologies Achieves ANSI/ESD S20.20 Certification
QP Technologies announced it has been certified ANSI/ESD S20.20-compliant by TÜV SÜD America Inc. one of only six certification bodies accredited to issue ...
|
February 7, 2024
VIEWPOINT 2024: Ken Molitor, Chief Operating Officer, QP Technologies
|
December 5, 2023
Durability and Cost Benefits Drive Mil-Aero Demand for OCPP
The white paper details a real-world use case where dummy IC packages converted to Open-Cavity Plastic Packages (OCPP) passed stringent burn-in and MSL tests equivalent to factory-fresh parts.
|
October 17, 2023
Optimizing New Power Switch Technology Using Compound Semiconductors
In this white paper, we detail our collaboration with high-profile startup Ideal Power to devise a commercial packaging solution that yielded the industry's first fully functioning B-TRAN double-sided power switches.
|
January 19, 2023
VIEWPOINT 2023: Ken Molitor, Chief Operating Officer, QP Technologies
QP Technologies, a premier U.S.-based provider of IC assembly and packaging services, experienced 15% annual revenue growth in 2022 while growing headcount by ~20%. Hiring best-in-class employees continues to be our focus, as does face-to-face customer interaction whenever possible. Business was up in all ...
|
August 20, 2021
QP Technologies Installs New Wire Bonders, Broadening Reach in Mil-Aero, RF & Power Markets
QP Technologies (formerly Quik-Pak) announced it has installed two new Hesse Mechatronics ultrasonic wire bonders at its wholly owned 20,000-square-foot facility. The fully ...
|
|
We search for industry news so you don't need to.
|
|
Free Newsletter Subscription
Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.
Insert Your Email Address
|
|