| Press Release |
July 30, 2024 - Click the title to read the full press release.
Amkor Technology has announced that it has signed a non-binding preliminary memorandum of terms with the US Department of Commerce to receive proposed ...
Amkor Technology, Inc.
June 13, 2025
Analysis Of Multi-Chiplet Package Designs and Requirements for Production Test Simplification
This white paper discusses the rising complexity of multi-die semiconductor packages, challenges in testing interconnected chips, and how standards like UCIe simplify production testing workflows.
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April 30, 2025
Amkor Technology to Present at the J.P. Morgan Global Technology Conference
Amkor Technology, Inc. announced that it will participate in the J.P. Morgan Global Technology, Media and Communications Conference on Tuesday, May 13, 2025. ...
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February 12, 2025
Amkor Technology Reports Financial Results for the Fourth Quarter and Full Year 2024
Amkor Technology, Inc. announced financial results for the fourth quarter and full year ended December 31, 2024. "In 2024, weakness in the automotive and industrial ...
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December 24, 2024
Package Integrated Vapor Chamber Heat Spreaders
Advances in vapor chamber technology revolutionize thermal management, delivering up to 12.5°C cooler performance than copper spreaders. These integrated chambers now enhance efficiency in smartphones, high-performance GPUs, and other high-power computing devices.
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November 26, 2024
Electromigration Performance Of Fine-Line Cu RDL For HDFO Packaging
The study highlights High-Density Fan-Out (HDFO) packages' fine copper redistribution layer (Cu RDL) reliability under electromigration (EM). Findings include distinct failure modes, resistance changes, and current-carrying capacity estimations crucial for advanced electronics design.
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November 20, 2024
Lightmatter and Amkor Partner to Build World's Largest 3D Photonics Package
Lightmatter announced a strategic partnership with Amkor Technology to create the largest-ever 3D-packaged chip complex utilizing Lightmatter's innovative Passage™ platform. ...
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October 23, 2024
LAB Flip Chip Reflow Process Robustness Prediction By Thermal Simulation
Mass reflow (MR) processes face challenges with package warpage and solder joint quality in fine-pitch devices. Laser-assisted bonding (LAB) offers precise, localized heating, enhancing soldering quality and reducing warpage.
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October 9, 2024
Amkor and TSMC to Expand Partnership and Collaborate on Advanced Packaging in Arizona
Amkor Technology, Inc. and TSMC announced today that the two companies have signed a memorandum of understanding to collaborate and bring advanced packaging and ...
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September 24, 2024
James J. Kim to Retire as Executive Chairman
Amkor Technology, Inc. announced that James Kim will be stepping down as Executive Chairman of Amkor and retiring from the company effective October 31, 2024. Susan Kim ...
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September 23, 2024
Enabling A Chiplet Supply Chain
Chiplet-based architectures are on the rise, offering smaller die sizes and improved yields over large SoCs. Despite benefits in cost and performance, challenges like power management, security, and supply chain complexity persist, with UCIe pushing for standardization.
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