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IR Layer Release Technology for 3D Packaging and Logic Scaling
Ultra-thin layer transfer from silicon carriers with nanometer precision using an IR laser and inorganic release layers revolutionizes 3D packaging & logic scaling.
EV Group

Press Release

July 10, 2024 - Click the title to read the full press release.

Sony is set to capture 50% of the CIS market

According to Florian Domengie, Ph.D., Senior Technology & Market Analyst, Imaging, at Yole Group: "Looking ahead, the automotive image sensor market is poised for substantial ...

YOLE Group

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Multi-Sensor Metrology
Users want to measure various applications on one tool rather than several tools to get the required results. Ultra-precise, non-contact measuring techniques work for packaging applications.
Camtek