Press Release
July 10, 2024  -  Click the title to read the full press release.

The Power of 2.5D TSV Technology



Amkor's 2.5D TSV technology is revolutionizing the high-performance computing (HPC) sector and artificial intelligence (AI) applications. But what makes 2.5D TSV so groundbreaking? ...

Amkor Technology, Inc.
July 19, 2024
Infineon and Amkor Announce Strategic Partnership for Supply Chain Sustainability
Infineon Technologies AG has signed a Memorandum of Understanding with Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of semiconductor packaging ...
July 10, 2024
The Power of 2.5D TSV Technology
Amkor's 2.5D TSV technology is revolutionizing the high-performance computing (HPC) sector and artificial intelligence (AI) applications. But what makes 2.5D TSV so groundbreaking? ...
July 2, 2024
Amkor's Science-Based Net-Zero Targets Approved by SBTi
Amkor Technology, Inc. announced today that the Science Based Targets initiative (SBTi) has verified Amkor’s near- and long-term science-based emissions reduction ...
April 30, 2024
Amkor Reports Financial Results for the First Quarter 2024
Amkor Technology, Inc. announced financial results for the first quarter ended March 31, 2024. First Quarter 2024 Highlights Net sales $1.37 billion, Gross profit ...
April 10, 2024
Infineon and Amkor Deepen Partnership and Strengthen European Supply Chain
Infineon Technologies AG is strengthening its outsourced backend manufacturing footprint in Europe and announced a multi-year partnership with Amkor Technology, Inc. ...
February 26, 2024
Peoria Approves Development Agreement For Amkor's Advanced IC Packaging Facility
The Peoria City Council approved a Development Agreement with Tempe-based Amkor Technology, at the Tuesday night Regular Council Meeting, for the future location ...
February 8, 2024
Amkor Technology Reports Financial Results for the Fourth Quarter and Full Year 2023
Amkor Technology, Inc., a leading provider of semiconductor packaging and test services, announced financial results for the fourth quarter and full year ended December 31 ...
February 6, 2024
S-SWIFT® Packaging with Fine Pitch Embedded Trace RDL
S-SWIFT® packaging was successfully demonstrated by heterogeneous integration of the ASIC and HBMs with ETR technology and Flip Chip assembly.
January 18, 2024
Amkor and GlobalFoundries Cut Ribbon on Strategic Cooperation in Portugal
Amkor Technology, Inc. and GlobalFoundries (GF) will officially kick off their strategic partnership in Europe with a ribbon cutting ceremony at Amkor’s Porto, Portugal, facility ...
December 14, 2023
Amkor Submits Net Zero Goal to SBTi
mkor Technology, Inc. announced today that it has committed to achieving net zero greenhouse gas emissions by 2050. The net ...
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