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Die-Module Attach (Pastes & Films)
Die-Attach Adhesives with low moisture absorption for MSL Level-1 applications for reliability. Outstanding thermal conductivity with low moisture absorption- stress-free bonding.
AI Technology, Inc.
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| Press Release |
April 3, 2024 - Click the title to read the full press release.
Indium Corporation's Senior Global Product Manager for Semiconductor and Advanced Materials, Sze Pei Lim, is scheduled to present at the International Conference on ...
Indium Corporation
April 24, 2025
Indium Corporation Experts to Present on Power Electronics at PCIM Europe 2025
As one of the leading materials providers to the power electronics assembly and e-Mobility industries, Indium Corporation experts will share their technical insight and knowledge ...
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April 16, 2025
Indium to Feature Materials Solutions Powering Sustainability at PCIM Europe
As one of the leading materials providers in the electronics assembly and solder industries, Indium Corporation® is proud to feature its lineup of high-reliability products at PCIM ...
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March 24, 2025
Dr. Yan Liu of Indium Corporation Named as MACNY's 2025 Innovator of the Year
MACNY, The Manufacturers Association, is proud to announce Dr. Yan Liu, Director of Global Research and Development (R&D) at Indium Corporation, as the recipient of the 2025 ...
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March 5, 2025
Indium Corporation Powering Sustainability at APEC 2025
As one of the leading materials providers in the electronics assembly and solder industries, Indium Corporation® is proud to feature its lineup of high-reliability products at APEC ...
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March 4, 2025
Indium Corporation to Feature New Heat-Spring® Metal TIM at SEMI-THERM 2025
Indium Corporation® will feature its lineup of high-reliability, low-temperature thermal interface material (TIM) products at SEMI-THERM 2025, taking place March 10-14 in San Jose ...
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March 3, 2025
Indium Corporation to Introduce New Heat-Spring® HSx Metal Thermal Interface Material at TestConX
Indium Corporation® is set to introduce its newest Heat-Spring® pattern—HSx. Designed for large area dies with warpage challenges and pressure limitations, HSx will be ...
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February 28, 2025
Indium Expert to Present on Gold Solder Solutions for Medical Applications at IMAPS 2025 Workshop
Indium Corporation Senior Product Specialist Jason Farrell will deliver a technical presentation at the IMAPS Advanced Packaging for Medical Microelectronics Workshop ...
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February 19, 2025
VIEWPOINT 2025: Ross Berntson, President and CEO, Indium Corporation
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February 5, 2025
Indium Corporation Expert to Address Thermal Challenges at TestConX 2025
Indium Corporation Technical Support Engineer Carson Burt will deliver a technical presentation at TestConX 2025, taking place March 3-5 in Mesa, Arizona. The presentation ...
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January 22, 2025
Indium Corporation to Feature Precision Au-Based Die-Attach Preforms at SPIE Photonics West
Indium Corpor ation® will feature its high-reliability, Au-based precision die-attach preforms for critical laser and RF applications at SPIE Photonics West, Jan. 28-30 ...
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| Sponsor |
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Proven SiPaste® for Ultrafine Printing
Boost SPI yields with SiPaste® C201HF. Formulated for fine feature printing, it combines superior non-wet open performance with excellent stencil print transfer efficiency.
Indium Corporation
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