Press Release
April 3, 2024  -  Click the title to read the full press release.

Henkel semiconductor capillary underfill enables complex AI and HPC large body advanced packaging designs



Henkel announced that it has commercialized a semiconductor capillary underfill encapsulant to address the unique requirements of the market's most demanding ...

Henkel Corporation
April 11, 2024
Henkel innovation strength rewarded; two leading-edge products land high honors
Henkel announced that two of its latest electronic material innovations were named best-in-class in Circuits Assembly magazine's NPI Award program, which recognizes ...
April 3, 2024
Henkel semiconductor capillary underfill enables complex AI and HPC large body advanced packaging designs
Henkel announced that it has commercialized a semiconductor capillary underfill encapsulant to address the unique requirements of the market's most demanding ...
February 28, 2024
VIEWPOINT 2024: Ramachandran "Ram" K. Trichur, Global Market Segment Head, Semiconductor Packaging Materials, Henkel
November 28, 2023
Henkel thin bondline phase change TIM earns industry award for innovation
Henkel announced that its new phase change thermal interface material (TIM), Bergquist® Hi Flow THF 5000UT, has been named the Global Technology Awards' TIM category ...
September 7, 2023
Henkel highlights portfolio of enabling materials for next-gen semiconductor devices at SEMICON Taiwan
At SEMICON Taiwan, Henkel brings its extensive range of semiconductor packaging material solutions to customers in a collaborative setting designed to foster discussions ...
May 23, 2023
Low-pressure, thin bond line TIM from Henkel brings best-in-class thermal management solution for next-gen ICs
Adding to its broad portfolio of thermal interface material (TIM) innovations, Henkel today announced the commercial availability of Bergquist® Hi Flow THF 5000UT. The phase ...
May 9, 2023
Henkel debuts ultra-high thermal conductivity pressure-less sintering die attach adhesive
Henkel announced the addition of Loctite Ablestik ABP 8068TI to its growing portfolio of high thermal die attach adhesives. With 165 W/m-K ...
April 10, 2023
Henkel semiconductor packaging innovations earn Material Supplier of the Year Award
Henkel announced that it has earned the Material Supplier of the Year distinction from the 3D InCites community as part of its recent ...
March 21, 2023
Henkel delivers versatile, high thermal die attach adhesive for Power IC applications
As integrated circuits (ICs) become more dense and complex, particularly in the power device sector, new approaches to die thermal control and electrical performance are required. ...
February 22, 2023
VIEWPOINT 2023: Ramachandran "Ram" K. Trichur, Global Market Segment Head, Henkel
We started 2022 on the heels of what I call a 'magical year' in the semiconductor packaging market, with unprecedented demand from all sectors — consumer electronics, 5G, and automotive — converging in 2021. It was a record-setting performance for the industry that will be hard to reproduce. Because of this ...
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