Press Release |
February 8, 2024 - Click the title to read the full press release.
Amkor Technology, Inc., a leading provider of semiconductor packaging and test services, announced financial results for the fourth quarter and full year ended December 31 ...
Amkor Technology, Inc.
December 24, 2024
Package Integrated Vapor Chamber Heat Spreaders
Advances in vapor chamber technology revolutionize thermal management, delivering up to 12.5°C cooler performance than copper spreaders. These integrated chambers now enhance efficiency in smartphones, high-performance GPUs, and other high-power computing devices.
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November 26, 2024
Electromigration Performance Of Fine-Line Cu RDL For HDFO Packaging
The study highlights High-Density Fan-Out (HDFO) packages' fine copper redistribution layer (Cu RDL) reliability under electromigration (EM). Findings include distinct failure modes, resistance changes, and current-carrying capacity estimations crucial for advanced electronics design.
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November 20, 2024
Lightmatter and Amkor Partner to Build World's Largest 3D Photonics Package
Lightmatter announced a strategic partnership with Amkor Technology to create the largest-ever 3D-packaged chip complex utilizing Lightmatter's innovative Passage platform. ...
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October 23, 2024
LAB Flip Chip Reflow Process Robustness Prediction By Thermal Simulation
Mass reflow (MR) processes face challenges with package warpage and solder joint quality in fine-pitch devices. Laser-assisted bonding (LAB) offers precise, localized heating, enhancing soldering quality and reducing warpage.
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October 9, 2024
Amkor and TSMC to Expand Partnership and Collaborate on Advanced Packaging in Arizona
Amkor Technology, Inc. and TSMC announced today that the two companies have signed a memorandum of understanding to collaborate and bring advanced packaging and ...
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September 24, 2024
James J. Kim to Retire as Executive Chairman
Amkor Technology, Inc. announced that James Kim will be stepping down as Executive Chairman of Amkor and retiring from the company effective October 31, 2024. Susan Kim ...
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September 23, 2024
Enabling A Chiplet Supply Chain
Chiplet-based architectures are on the rise, offering smaller die sizes and improved yields over large SoCs. Despite benefits in cost and performance, challenges like power management, security, and supply chain complexity persist, with UCIe pushing for standardization.
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August 21, 2024
A Hybrid PLP Technology Based On A 650 X 650 mm Platform
A novel panel-level packaging technology, Hybrid PLP, reduces costs by enabling the processing of multiple wafers on a large 650mm x 650mm panel. It enhances reliability and flexibility for advanced chip applications.
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August 1, 2024
Amkor Reports Financial Results for the Second Quarter 2024
Amkor Technology, Inc. announced financial results for the second quarter ended June 30, 2024. "Amkor delivered second quarter results in line with expectations. Revenues ...
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July 31, 2024
Advanced Packaging for Next-Generation Vehicle
Automotive processors are swiftly adopting advanced semiconductor technologies, including 5 nm and 3 nm processes. This shift necessitates advanced packaging due to challenges in I/O density, chip size reductions, and memory bandwidth.
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