Press Release
March 15, 2023  -  Click the title to read the full press release.

IMAPS Advanced System-in-Package Conference is now CHIPcon



IMAPS has rebranded its well-attended, annual Advanced System-in-Package conference to the Chiplet & Heterogeneous Integration Packaging Conference (CHIPcon). As the ...

IMAPS
August 3, 2023
IMAPS-UK: What Future do you Want to Connect with?
Electronic packaging covers the materials and assembly processes used to connect semiconductor devices to the outside world. As the complexity and adoption of electronics ...
March 15, 2023
IMAPS Advanced System-in-Package Conference is now CHIPcon
IMAPS has rebranded its well-attended, annual Advanced System-in-Package conference to the Chiplet & Heterogeneous Integration Packaging Conference (CHIPcon). As the ...
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