November 22, 2022|
TechSearch International Analyzes Impact of Slowing Demand on FC and WLP
TechSearch International's latest report: 2022 Flip Chip and WLP: Trends and Market Forecasts examines the impact of slowing consumer demand on the flip chip and WLP ...
July 27, 2022|
TechSearch Int'l Examines High-Performance Package Options
TechSearch International's latest analysis describes high-performance package options with an update on TSMC's new offerings, including ...
May 18, 2022|
TechSearch International's Analysis Examines Impact of World Events, Material Shortages
2021 was a record year for the semiconductor industry and OSAT revenues, but the outlook ...
March 1, 2022|
Semiconductor Assembly and Test Facility Database Now Tracks Integrated Device Manufacturers
SEMI and TechSearch International announced a new edition of the Worldwide Assembly & Test Facility Database offering significantly expanded coverage that now includes integrated ...
February 15, 2022|
TechSearch International's Analysis Shows Build-up Substrate Shortage Could End in 2026
The shortage of build-up substrates will be worse this year than in 2021, and the gap between supply and demand looms even larger in 2023. Many substrate makers are adding ...
August 9, 2021|
TechSearch International's Analysis Shows Shortage of FC-BGAs Substrates Persists
Despite capacity increases this year, and additional plans through 2025, demand for FC-BGA substrates is outstripping supply. What's driving the insatiable demand? ...
June 28, 2021|
What's in the Apple Watch Series 6?
TechSearch International's teardown of the Apple Watch Series 6 GPS+LTE examined 108 board-level packages plus another 17 packages inside modules and found 27% more wafer ...
June 2, 2021|
TechSearch International's BGA and CSP Market Analysis
The industry saw strong production growth in 2020 and Q1 2021 was a record quarter compared to a year ago. Demand for PCs, especially laptops, tablets, wearables ...
March 25, 2021|
TechSearch International Analyzes Substrate Shortages and Explores Potential Solutions
Substrate capacity remains tight for both flip chip ball grid array (FC-BGA) substrates and laminate-based chip scale packages (CSPs). Substrate suppliers are adding capacity ...
February 23, 2021|
TechSearch International Quantifies Heterogeneous Integration Market Growth
The market for heterogeneous integration is projected to grow 10% in number of packages from 2020 to 2025, reaching almost 54 billion packages. Smartphones, wearables ...