| Press Release - Master Bond |
August 3, 2022 - Click the title to read the full press release.
Master Bond EP40ND is a two component epoxy system, designed for bonding, sealing and coating applications. It is a non-drip, toughened system with an easy to use 1:1 mix ...
Master Bond
August 3, 2022
Toughened, Non-Drip Epoxy Meets NASA Low Outgassing Specifications
Master Bond EP40ND is a two component epoxy system, designed for bonding, sealing and coating applications. It is a non-drip, toughened system with an easy to use 1:1 mix ...
|
June 15, 2022
Biocompatible UV Curable Adhesive Formulated for TPU Bonding
Master Bond UV17Med is a one part, no mix, UV curable system. It was specially formulated to provide excellent adhesion to many TPUs (thermoplastic polyurethanes) ...
|
May 16, 2022
Flowable Silicone Offers Thermal Cycling and Shock Resistance
Master Bond MasterSil 323 is a two component, addition cured system for bonding, sealing ...
|
April 14, 2022
Low Viscosity, Electrically Conductive Epoxy Meets ISO 10993-5 Cytotoxicity Standards
Master Bond EP4G-80Med is a one part epoxy designed for use in the assembly of medical devices. This system is formulated with a non-metallic, graphite filler, which ...
|
March 16, 2022
Thermally Conductive Epoxy Features Chemical and High Temperature Resistance
Master Bond EP35AOLV is a two part heat cured epoxy system, designed for bonding, sealing, coating and potting applications. It is a thermally conductive, electrically insulating compound ...
|
February 2, 2022
UL Certified Epoxy Encapsulant Resists Arcing Without Igniting
Master Bond EP21AC is a two part epoxy with a non-halogenated filler that is formulated for applications where arc resistance and flame retardancy are required. Electrical arcing ...
|
January 10, 2022
Silver Filled, Low Outgassing Epoxy for EMI/RFI Shielding
Master Bond EP4S-80 is a one component silver filled epoxy which meets NASA low outgassing requirements. It has an unlimited working life at room temperature and a moderate ...
|
December 16, 2021
Thermally Conductive, Electrically Non-Conductive, Low Outgassing Epoxy
Master Bond EP40TC is a two part epoxy system, designed for bonding, sealing and encapsulating applications where thermal conductivity and electrical insulation are required. With ...
|
October 18, 2021
Non-Cytotoxic Epoxy Resists Sterilization by Autoclaving, Radiation and Chemicals
Master Bond EP62-1HTMed is a two part epoxy that meets the requirements of ISO 10993-5 for non-cytotoxicity and therefore can be utilized in many medical device applications. ...
|
September 27, 2021
Flexible, Low Viscosity LED Curable Adhesive with a Fluorescent Dye
Master Bond LED405FL3 is a flexible one component, LED curing adhesive system with excellent optical clarity and a refractive index of 1.51. Its flexibility allows for stress ...
|
|
|
We search for industry news so you don't need to.
|
|
|
Free Newsletter Subscription
Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.
Insert Your Email Address
|
|
