Press Release - JCET Group Co., Ltd.
November 29, 2021  -  Click the title to read the full press release.

JCET Continues to Expand Its Global Footprint at SEMICON Europa in Germany



The four-day SEMICON Europa 2021 came to a close. As a leading global IC manufacturing and technology service provider, JCET participated for the first time in this European semiconductor ...

JCET Group Co., Ltd.
November 30, 2021
JCET Expands Production Capacity in Suqian to Better Serve Global Customer Needs
Today, JCET Group announced the official opening of the second phase of its IC packaging and testing facility in Suqian. With the completion of this new portion of the facility in Suqian ...
November 29, 2021
JCET Continues to Expand Its Global Footprint at SEMICON Europa in Germany
The four-day SEMICON Europa 2021 came to a close. As a leading global IC manufacturing and technology service provider, JCET participated for the first time in this European semiconductor ...
November 4, 2021
JCET Continues Strong 2021 with Another Record High Performance in Q3
JCET Group announced its financial results for the third quarter of 2021. According to the financial report, JCET achieved revenue of RMB 8.10 billion in the third quarter, an increase ...
November 3, 2021
JCET Continues Strong 2021 with Another Record High Performance in Q3
JCET Group announced its financial results for the third quarter of 2021. According to the financial report, JCET achieved revenue of RMB 8.10 billion in the third quarter, an increase ...
August 25, 2021
JCET 1H 2021 Net Profit Jumps 261%, Earnings Surpass FY 2020 Mark
JCET announced its financial results for the first half year of 2021. According to the financial report, in 1H 2021, JCET maintained its momentum of growth and strong ...
August 12, 2021
Laser Assisted Bonding (LAB) for Fine Pitch Cost Effective Interconnection
For flip chip packaging with advanced Si nodes, fine bump pitch, fine LW/LS as well as large die sizes with high aspect ratios, LAB technology is the optimal methodology to implement ...
July 7, 2021
JCET Group Releases XDFOI Solutions Enabling Flexible Heterogeneous Integration
JCET Group announces the official launch of XDFOI™, an innovative solution for ultra-high-density fan-out packaging. This revolutionary technology will provide cost-effective ...
June 15, 2021
JCET Participating at the 2021 World Semiconductor Conference
On June 9th, with the theme of "Innovation for Development, Win-win for Growth", the 2021 World Semiconductor Conference was kicked off at Nanjing International Expo ...
June 9, 2021
Accelerating its Globalization, JCET Completes Acquisition of ADI's Singapore Test Facility
JCET Group announced that it has officially completed the acquisition of Analog Devices Inc.'s ("ADI") Singapore test facility, with its test staff to be transferred to the JCET operations ...
May 11, 2021
JCET Completes RMB 5 Billion Private Placement with Diversified Investment Structure
JCET Group recently announced that the company successfully completed a capital raising of approximately RMB 5 billion. The RMB 5 billion private placement successfully ...
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