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Medical Grade, Toughened Epoxy
Master Bond Supreme 121AOMed is a thermally conductive, electrically insulating adhesive that resists repeated autoclaving and is used for bonding, sealing and encapsulation.
Master Bond
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| Press Release |
June 21, 2021 - Click the title to read the full press release.
The Fraunhofer Institute for Photonic Microsystems IPMS and semiconductor intellectual property provider CAST, Inc. announced the immediate availability of EMSA5-FS ...
The Fraunhofer Institute
May 20, 2026
The Future of Chip Integration: Fraunhofer IPMS Develops High-Density Chiplet Systems at the Wafer Level
Breakthrough in chip manufacturing: As part of the European APECS pilot line, researchers at Fraunhofer Institute for Photonic Microsystems IPMS have developed a method ...
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March 25, 2026
CEA-Leti and Fraunhofer IPMS Validate Wafer Exchange for Ferroelectric Memory Materials
CEA-Leti and Fraunhofer IPMS have successfully completed the first exchange of ferroelectric memory wafers within the FAMES Pilot Line, marking a pivotal milestone in ...
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March 18, 2026
A new level of thin-film characterization is within reach
The Fraunhofer Institute for Photonic Microsystems IPMS has launched the publicly funded SMut project, in collaboration with its partners Credoxys and SweepMe! to develop ...
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February 25, 2026
Fraunhofer IPMS collaborates with Korean TSN Lab
The Fraunhofer Institute for Photonic Microsystems IPMS is working with the Korean TSN Lab on new real-time solutions as part of the "Global Cooperative R&D" funding ...
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February 2, 2026
Cutting-edge research for the European AI market
On October, the 1st 2025, the NeAIxt research project was launched, bringing together over 55 partners from across the EU. The project's long-term goal is to strengthen ...
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November 5, 2025
From Semiconductor Technology to Quantum Computing: Light Modulation Solutions for Japan's Key Industries
The Fraunhofer Institute for Photonic Microsystems IPMS in Germany is a leading research institute in the area of spatial light modulators (SLMs), a technology that ...
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July 21, 2025
Fraunhofer IPMS and DIVE Optimize Semiconductor Processes with Cutting-Edge Measurement System
The Fraunhofer Institute for Photonic Microsystems IPMS, in collaboration with DIVE imaging systems GmbH, has achieved a major milestone in resource-efficient semiconductor ...
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June 26, 2025
Design tools for improved hardware security of RFETs
Chip design is a crucial step in the development of application-specific microelectronic components and must take functionality, reliability and security aspects into ...
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June 9, 2025
Project GENESIS minimizes ecological footprint in Europe's semiconductor industry
A pan-European consortium dedicated to developing sustainable processes and technologies for the semiconductor-manufacturing supply chain announces the launch ...
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June 4, 2025
Successful Development of Innovative and Versatile Evaluation Platform for Spatial Light Modulators
For the first time, Fraunhofer IPMS presents its advanced, high-performance evaluation kits for spatial light modulators, which now feature tilting or piston mirrors as actuator ...
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