Press Release - JCET Group Co., Ltd.
May 3, 2021  -  Click the title to read the full press release.

Strategies for Growth Propel JCET to Quarterly Highs for Revenue and Profit



JCET announced its financial results for the first quarter of 2021 ended March 31, 2021. According to the financial report, in Q1 2021, JCET maintained its momentum of growth ...

JCET Group Co., Ltd.
May 4, 2021
JCET Opens New Business Centers for Automotive Electronics and IC Design Services
JCET announced the official opening of its Automotive Electronics Business Center and Design Services Business Center. The opening ceremony was held at Pudong, Shanghai. ...
May 3, 2021
Strategies for Growth Propel JCET to Quarterly Highs for Revenue and Profit
JCET announced its financial results for the first quarter of 2021 ended March 31, 2021. According to the financial report, in Q1 2021, JCET maintained its momentum of growth ...
April 30, 2021
JCET Innovation and Manufacturing Strategies Deliver Record High Revenue for FY2020
During the reporting period, we optimized the business model for the purchase and sale of certain packaged products, of which JCET Group no longer bears the general ...
November 16, 2020
STATS ChipPAC named one of Randstad's "Best Companies to Work For" in Singapore for 2020
The results of this year's Randstad Employer Brand Research survey were just announced, with STATS ChipPAC, a subsidiary of JCET Group Co., Inc., being recognized as one of ...
November 4, 2020
JCET's Global Manufacturing Strategy Produces Records for Revenue & Profit in Q3
JCET Group Co., Ltd. announced financial results for the third quarter 2020, ended September 30, 2020. Revenue was RMB 6.79 billion and net profit was RMB 0.40 billion ...
March 24, 2020
Backside Metallization for Low Cost High Thermal Package
Advanced semiconductor packaging requirements for higher and faster performance continue to be the driver for mining and artificial intelligence (AI)/high performance computing ...
June 17, 2019
Advanced Wafer Level PKG Solutions for Telecom Infrastructure
In this work, a highly integrated WiGig/802.11ad compliant 16+16 beam forming transceiver RFIC with advanced FOWLP (fan out wafer level packaging) technology ...
March 21, 2017
STATS ChipPAC Achieves 1.5 Billion Unit Milestone in Fan-out Wafer Level Packaging Shipments
STATS ChipPAC Pte. Ltd. announced that it has shipped 1.5 billion fan-out wafer level packages (FOWLP), also known in the industry as embedded Wafer Level Ball Grid ...
May 16, 2016
STATS ChipPAC's Fan-out Wafer Level Packaging Shipments Exceed 1 Billion Units
STATS ChipPAC Pte. Ltd. announced that it has shipped over one billion fan-out wafer level packages (FOWLP), also known in the industry as embedded Wafer ...
January 20, 2016
STATS ChipPAC Ranked in Top 10 Semiconductor Equipment Manufacturing Companies
STATS ChipPAC Ltd. announced that it has been ranked among the world's top 10 semiconductor equipment manufacturing companies in the 2015 Patent Power ...
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