Press Release - UTAC Group
January 18, 2021  -  Click the title to read the full press release.

UTAC completes acquisition of Singapore Wafer Bumping Assets



UTAC Holdings Ltd. announced that its affiliate ("UTAC" or "the Company") has completed its purchase of the Singapore-based wafer bumping assets from Powertech Technology ...

UTAC Group
January 25, 2021
What can we expect from autonomous vehicles?
There is a lot of evidence to show that ADAS (Advanced Driver Assistance Systems) can make vehicles safer, with many consumers expressing a desire to see these ...
January 18, 2021
UTAC completes acquisition of Singapore Wafer Bumping Assets
UTAC Holdings Ltd. announced that its affiliate ("UTAC" or "the Company") has completed its purchase of the Singapore-based wafer bumping assets from Powertech Technology ...
November 20, 2020
Future Growth of the Semiconductors
Prices, technology convergence or packaging, what will fuel future growth in the semiconductor market? In this paper, Asif Chowdhury shares his thoughts and expectations.
September 4, 2020
MEMS Packaging for High Volume Products
MEMS, an enabling technology opening new applications, such as the IoT, wearable technology smart devices, autonomous vehicles and automotive industry. ...
August 5, 2020
UTAC receives a Pinnacle Supplier Award from ON Semiconductor
UTAC Holdings Ltd. announced that the company received the 2019 Pinnacle Supplier Award from ON Semiconductor. The award is given to top suppliers who provide ...
March 3, 2020
Thermal and Mechanical Analysis of Imaging BGA Image Sensor Package
The growing demand of smartphone, cameras and automotive pushes image sensor packaging to smaller form factor and more complex substrate design. A study is ...
February 10, 2020
VIEWPOINT 2020: Asif R Chowdhury, Senior VP, Marketing & Corporate Business Development & Japan Business, UTAC
Chowdhury_-Asif_60-75.jpg
2019 was unfortunately not a great year for overall semiconductor market. Analysts estimate that unit shipment in 2019 will be down by more than 4% - first time semiconductor unit shipment will go negative since 2001. Minus memory, part of slow 2019 was due to slow mobile handset sales which is one of the dominant users ...
February 5, 2020
New Development of Thermally Enhanced GaN QFN with Heat Slug Attach Bonding Technology
GaN mosfet provides significantly lower resistance and low capacitance than silicon mosfet which makes GaN mosfet considered as alternative power devices to replace ...
December 19, 2019
UTAC receives safety-critical automotive quality accreditation for three factory locations
UTAC Holdings Ltd. announced that three further factories have been accredited to the stringent automotive quality standard, ISO26262. Following the recent announcement  ...
November 19, 2019
UTAC receives accreditation to safety-critical automotive quality standard
UTAC Holdings Ltd. announced that they have been awarded the prestigious automotive-related quality standard ISO26262 for their automotive manufacturing focused ...
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