Press Release - StratEdge Corporation
November 19, 2020  -  Click the title to read the full press release.

StratEdge Molded Ceramic: Straightforward Packaging Solutions for GaN Used in Mil-Std Applications



StratEdge Corporation announces that its off-the-shelf line of molded ceramic packages can be configured to meet the requirements for chips with frequencies up to 18 GHz ...

StratEdge Corporation
November 19, 2020
StratEdge Molded Ceramic: Straightforward Packaging Solutions for GaN Used in Mil-Std Applications
StratEdge Corporation announces that its off-the-shelf line of molded ceramic packages can be configured to meet the requirements for chips with frequencies up to 18 GHz ...
October 7, 2020
StratEdge to Display New Broadband QFNs and Revolutionary Eutectic Die Attach for GaN Devices at IMAPS
StratEdge Corporation announces that StratEdge technical experts will be available to discuss the best types of packaging and assembly services for devices at the Virtual ...
October 5, 2020
Optimizing High Power GaN Device Performance With Eutectic Die Attach
StratEdge paper details how to reduce chip-to-package junction temperature to improve GaN chip efficiency and reliability. Learn more about specialized packages ...
September 22, 2020
StratEdge Reports A Strong Third Quarter
StratEdge Corporation announces a strong third quarter with a marked increase recently in requests for 5G-related quotes and contract orders when compared to the rest ...
August 14, 2020
StratEdge White Paper, 'Eutectic Die Attach Optimizes High Power GaN Devices,' is Now Available
StratEdge Corporation announces that the white paper, "Eutectic Die Attach Optimizes High Power GaN Devices," is now available on the StratEdge website. The article ...
June 11, 2020
StratEdge Expands Production Capacity of its RF Packaging Line
StratEdge Corporation announces the expansion of its production line for building ceramic and molded ceramic packages to support 5G infrastructure demands. The packages ...
February 27, 2020
StratEdge Features its Semiconductor Packages and Assembly Services at Three Trade Shows
StratEdge Corporation will have applications specialists available at the IMAPS Device Packaging Conference, APEC 2020, and GOMACTech 2020 to discuss the many–...
January 15, 2020
Regi Nocom Joins StratEdge as Process Engineer
StratEdge Corporation announces that Reginald (Regi) Nocom has joined StratEdge as a process engineer. With over 20 years in the microelectronics industry and extensive ...
January 3, 2020
VIEWPOINT 2020: Casey Krawiec, VP of Global Sales, StratEdge Corporation
krawiec_-casey_60-75.jpg
StratEdge Corporation designs and manufactures high-performance semiconductor packages as well as provides chip assembly and test services in Santee, California (near San Diego). We specialize in packaging high-frequency and very high-power Gallium Arsenide (GaAs) and Gallium Nitride (GaN) devices. StratEdge ...
October 28, 2019
StratEdge Offers Assembly Services for Die Attachment on CMC Tabs
StratEdge Corporation announces its assembly services for attaching gallium nitride (GaN) and other high-frequency, high-power devices using gold-tin (AuSn) ...
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