Press Release - SMTA
October 13, 2020  -  Click the title to read the full press release.

IWLPC Panel Addresses Future Advanced Packaging Challenges



The International Wafer-Level Packaging Conference and Expo announces a panel discussion titled "Meeting Future Advanced Packaging Challenges: What's Next?" ...

SMTA
October 13, 2020
IWLPC Panel Addresses Future Advanced Packaging Challenges
The International Wafer-Level Packaging Conference and Expo announces a panel discussion titled "Meeting Future Advanced Packaging Challenges: What's Next?" ...
September 4, 2020
Samsung VP to Keynote IWLPC
The International Wafer-Level Packaging Conference and Expo announces Dan Oh, Ph.D., Engineering VP of the Test & System Package (TSP) unit at Samsung Electronics will deliver ...
September 2, 2020
Samsung VP to Keynote IWLPC
The International Wafer-Level Packaging Conference and Expo announces Dan Oh, Ph.D., Engineering VP of the Test & System Package (TSP) unit at Samsung Electronics will ...
July 22, 2019
IWLPC Program Announced and Registration Now Open
The Surface Mount Technology Association (SMTA) and Chip Scale Review are pleased to announce the program for the 16th annual International Wafer-Level Packaging ...
February 26, 2019
Submit an abstract for eSmart Factory Conference 2019
Robotic and Cobot technologies are also central to these new smart factory environments. Robots are increasingly employed for repetitive assembly areas ...
February 5, 2019
IWLPC Technical Committee Announces Best Presentation & Papers Awards for 2018
The IWLPC Technical Committee is pleased to announce the Best of Conference, Best Presentation & Best Papers in WLP, 3D, Advanced Manufacturing and Test tracks ...
December 8, 2017
Pan Pacific Microelectronics Symposium Program Finalized
SMTA announced that the program is finalized for the 23rd Annual Pan Pacific Microelectronics Symposium. The event will take place February 5-8, 2018 at the Hapuna Beach ...
August 31, 2017
International Wafer-Level Packaging Conference (IWLPC) Workshops
The SMTA and Chip Scale Review are pleased to announce the Workshops for the 14th Annual International Wafer-Level Packaging Conference (IWLPC) held October 26th. IWLPC ...
July 24, 2017
IWLPC Program Announced and Registration Now Open
The SMTA and Chip Scale Review are pleased to announce the program for the 14th annual International Wafer-Level Packaging Conference. The IWLPC will be held ...
May 26, 2017
SMTA, iNEMI, MEPTEC Seek Presenters for 2018 Medical Electronics Symposium
The 2017 Medical Electronics Symposium will be held at University of Texas at Dallas, on May 16-17, 2018. SMTA, iNEMI, and MEPTEC have again joined forces to host the Int'l Symposium ...
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