Press Release - Henkel Corporation
September 16, 2020  -  Click the title to read the full press release.

Henkel Enhances its Die Attach Film Technology



Henkel Corporation announced that it has entered into a license agreement with Furukawa Electric Co., Ltd. In this agreement, Henkel has received a non-exclusive license ...

Henkel Corporation
September 16, 2020
Henkel Enhances its Die Attach Film Technology
Henkel Corporation announced that it has entered into a license agreement with Furukawa Electric Co., Ltd. In this agreement, Henkel has received a non-exclusive license ...
August 31, 2020
Material Breakthrough for Fan-In and Fan-Out WLPs
Anhydride-free liquid compression molding material addresses the stability, handling, protection, and thin dimensional challenges of new packaging techniques. Learn more.
July 24, 2020
Road-Tested Semiconductor Materials
Semiconductor technology is the fuel driving modern-day automotive capability and sector growth. Meeting the strict requirements is no easy task, but Grade 0 die attach ...
May 7, 2020
Thermal Gel from Henkel lets 5G Telecom Components go Vertical
As the 5G wireless broadband connection standard continues to gain traction, development and deployment of next-generation systems that can reliably manage high volumes ...
March 11, 2020
New microTIM from Henkel Lowers Networking Line Card Heat for Optimized Datacenter Performance
To manage the greater data bandwidth needs inherent with 4k rich media streaming, machine learning, data mining, and analytics, next-generation hyper-scale and cloud-scale ...
January 29, 2020
VIEWPOINT 2020: Ram Trichur, Global Market Segment Head, Henkel Corporation
Trichur_Ram_70-55.jpg
As a global company that is well-resourced, Henkel is positioned to support our customers in all regions, and our ability to stabilize supply has helped limit our customers' tariff impact. This is positive news as we move into what most predict will be a growth year for the semiconductor industry. While 2019 saw year-over-year⏈...
September 18, 2019
Henkel Features Material Solutions for High-Reliability Applications at IMAPS 2019
Henkel's presence at the upcoming IMAPS symposium, taking place September 30 - October 3 in Boston, MA, will center on its high reliability know-how at the wafer and board ...
May 13, 2019
5G- and Automotive ADAS-enabling Henkel Materials Featured at ECTC 2019
The drive to develop electronic materials capable of handling the reliability and performance demands of emerging integrated packages for 5G wireless communication ...
April 4, 2019
Henkel Debuts Assembly Adhesive for Optical Fiber Applications
Henkel Corporation's Adhesive Electronics (AE) business announced the commercial availability of a new, high-strength adhesive designed for streamlined assembly of optical components ...
January 15, 2019
VIEWPOINT 2019: Poupak Khodabandeh, Vice President and Global Head Semiconductor Packaging Materials, Henkel Corporation
Poupak-Khodabandeh-2019_60-.jpg
The electronics assembly value chain is in the midst of a renaissance and the semiconductor packaging industry is at the center of this transformation. Significant consolidation and shifts across the pillars of the electronics assembly industry -- with impacts to the semiconductor packaging ecosystem -- are being driven ...
Free Newsletter Subscription
Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.

Insert Your Email Address