Press Release - Finetech
September 14, 2020  -  Click the title to read the full press release.

New Femtoblu Micro Assembly Cell for Photonic Component Assembly



FINETECH announces the latest addition to the FINEPLACER® family, the FINEPLACER® femtoblu bonding system. This automated micro assembly cell is an efficient and ...

Finetech
September 14, 2020
New Femtoblu Micro Assembly Cell for Photonic Component Assembly
FINETECH announces the latest addition to the FINEPLACER® family, the FINEPLACER® femtoblu bonding system. This automated micro assembly cell is an efficient and ...
February 26, 2020
VIEWPOINT 2020: Neil O'Brien, General Manager and COO, Finetech
Neil-O_Brien-Finetech_60-75_1.jpg
As we enter 2020, there are many emerging technologies that when combined, should continue to fuel growth in the advanced packaging world. As a supplier of die bonding solutions to academia, R&D, defense, and commercial production, Finetech has a unique view of the most exciting technologies coming to market. Some ...
August 6, 2019
FINETECH Expands with New Customer Center in Amherst, New Hampshire
FINETECH announces its new, larger facility in Amherst, New Hampshire. The stand-alone building houses the Finetech eastern sales and applications support team. Its extensive ...
November 2, 2018
Stanford Nanofabrication Facility Partners with Finetech on Die Bonding Technologies
The FINEPLACER® Lambda, a flexible sub-micron die bonder for precision die attach and chip packaging, is an integral part of the SNF lab's equipment capabilities ...
July 19, 2017
Universal Instruments Installs Finetech Multipurpose Bonder
Finetech and Universal Instruments announce the addition of a FINEPLACER° Pico bonding system to the Universal Instruments Advanced Process Laboratory. The Universal ...
January 24, 2017
Finetech's Sigma Bonder Selected for Canada's National Optics Institute
Finetech and the National Optics Institute (INO) announce the addition of a FINEPLACER® Sigma bonding system at INO's micro-opto-electromechanical systems facility. ...
June 27, 2016
Finetech's Lambda Bonder Installed at Lurie Nanofabrication Facility
Finetech and the University of Michigan in Ann Arbor, Michigan announce the installation of a FINEPLACER® Lambda bonding system in the university's Lurie ...
March 11, 2016
Finetech's New Sub-Micron Bonder for Automated Micro Assembly - FINEPLACER® femto 2
Finetech will introduce its high-accuracy micro assembly solution, the FINEPLACER® femto 2 , at Semicon Shanghai 2016 (March 15-17, booth #2410). ...
February 2, 2016
VIEWPOINT 2016: Neil O'Brien, General Manger, Finetech
OBrien_Neil_60-75.jpg
In preparation for 2016 and coming years, Finetech laid the groundwork in 2015 for our next generation of technology and launched the future of our manufacturing capability. We are now producing our die bonders from a newly constructed production and development center in Berlin, Germany. This ...
January 7, 2016
Advanced Bonding Technologies for 3D Integration
This white paper covers interconnect technologies for 3D packaging applications with high bump count and fine pitch. The paper discusses various ...
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