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A study about 3D stacking of passive SMD elements
This study demonstrates laser assisted bonding (LAB) of SMD Tantal Elko and MLCC capacitors and presents a comparison to conventional bonding using solder paste and reflow oven.
PacTech

Technical Paper

Advanced Packaging for Next-Generation Vehicle

Automotive processors are swiftly adopting advanced semiconductor technologies, including 5 nm and 3 nm processes. This shift necessitates advanced packaging due to challenges in I/O density, chip size reductions, and memory bandwidth.
Amkor Technology, Inc.

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TrueFlat by BTU: Ensuring Consistent Flatness in Every Reflow Cycle.
BTU presents the Pyramax TrueFlat reflow oven. Say goodbye to substrate warpage and hello to reliable, repeatable flatness. Discover the TrueFlat advantage now!
BTU International