Technical Paper

Essential Practices for Gold Mitigation of Electronic Components

The ideal method to facilitate the repeatable and reliable removal of gold plating from electronic components is to use a robotic hot solder dipping (RHSD) process. This paper discusses the key practices of this specialized process.
Circuit Technology Center

Complete this form to download this Technical Paper.
Your Name

Your E-mail
Your Company

Your State, or Country if outside USA

More Technical Papers
Optimized Reflow Solder TIMs Processes for Heterogeneous Packages
Master Advanced Packaging Inspection
Packaging Solutions for Unique Markets
Keys to Component Lead Tinning Success
How Semiconductor Fabricators are Working Through Global FFKM Shortages
Mobile Antennas and Power Devices that Break the Mold
Atmospheric Oxygen-only Plasma for Decapsulation of Advanced Packages
Effects of Long-Term Storage on Mechanical and Electrical Integrity
The Great Debate: Ball Bonding vs Wedge Bonding
Chip-Last HDFO Interposer-PoP

Full Technical Paper List
Free Newsletter Subscription
Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.

Insert Your Email Address