Technical Paper: Side Wettable Flanks for Leadless Automotive Packaging

Technical Paper

Side Wettable Flanks for Leadless Automotive Packaging

Amkor's Wettable Flank technology for QFN (MLF®) packages streamlines solder joint inspection, enabling automotive and PCB assemblers to eliminate manual and X-ray inspection while improving quality and reducing cost.
Amkor Technology, Inc.

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