Technical Paper

An optimized die bonding setup for thermosonic bonding application



Ultrasonic power is introduced during thermocompression bonding to perform a die bonding process at low temperature and pressure. The paper describes briefly which requirements are applicable to improve the thermosonic bonding.
TRESKY Automation

Complete this form to download this Technical Paper.

Your Name


Your E-mail
Your Company


Your State, or Country if outside USA

More Technical Papers
Plasma Treatment during Fan-out Wafer-Level Packaging Optimizes Performance and Costs
Maskless Lithography Addresses Shift Toward 3D Integration
Optimizing High Power GaN Device Performance With Eutectic Die Attach
Halogen-free Microwave Induced Plasma Decapsulation of System in Package Modules
Challenges to Developing Automotive Grade 1/0 FCBGA Package Capability
Complete Warpage Control for Wafers and Panels
MEMS Packaging for High Volume Products
Material Breakthrough for Fan-In and Fan-Out WLPs
Package Converter Compliments Chip Obsolescence
Automated Eutectic Die Attach

Full Technical Paper List
Free Newsletter Subscription
Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.

Insert Your Email Address